Liquid drop discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture therof;color filter method of manufacture thereof; and device for manufacturing thereof; and device incorporating backing, method of manufacture thereof, and device for manufacture thereof

ABSTRACT

A liquid drop discharge device provides a head unit  420  which discharges filter element material relative to each of various colors of color filters. The head unit  420  is composed of an ink jet heads which are arranged on one end of a print substrate plate having a shape of rectangular card and head devices  433  which are arranged on the other end of the print substrate plate comprising connectors  441 . The head devices  433  are aligned in two rows, as two groups, in a staggered arrangement so that a portion on which the connectors  441  are aligned in one of the two rows does not face to the same portion of the other in the two rows and protrudes outside of the print substrate plate. The head unit  420  discharges the filter element material onto predetermined portions in a superimposing manner while shifting along a direction which intersects to a direction along which the head devices  433  are arranged.

This is a Division of application Ser. No. 11/433,449 filed May 15,2006, which in turn is a Continuation of Ser. No. 10/994,893 filed Nov.23, 2004, which in turn is a Division of application Ser. No. 10/815,752filed Apr. 2, 2004 (U.S. Pat. No. 6,837,568), which in turn is aDivision of application Ser. No. 10/314,261 filed Dec. 9, 2002 (U.S.Pat. No. 6,736,484). The entire disclosures of the prior applicationsare hereby incorporated by reference herein in their entirety.

FIELD OF THE INVENTION

The present invention relates to a discharge method and device fordischarging a liquid mass which has a certain flowability.

And, the present invention relates to an electro optical device such asa liquid crystal device, an electroluminescent device, an electricalmigration device, an electron emission device or a PDP (Plasma DisplayPanel) device or the like, to a method of manufacture of an electrooptical device for manufacturing such an electro optical device, and toa device for manufacturing the same. Furthermore, the present inventionrelates to a color filter which is used in an electro optical device,and to a method of manufacture of such a color filter and to a devicefor manufacturing the same. Yet further, the present invention relatesto a device which comprises a backing such as an electro optical member,a semiconductor device, an optical member, a reagent inspection memberor the like, and to a method of manufacture of such a device whichcomprises such a backing and to a device for manufacturing the same.

BACKGROUND ART

In recent years display devices which are so called electro opticaldevices, such as liquid crystal devices and electroluminescent devicesand the like, have become widespread as display sections for electronicdevices such as portable telephones, portable computers and the like.Furthermore, recently, it has become common to provide a full colordisplay upon such a display device. A full color display upon such aliquid crystal device is provided, for example, by passing light whichhas been modulated by a liquid crystal layer through a color filter. Andsuch a color filter is made by arranging filter elements of variouscolors such as R (red), G (green), and B (blue) in dot form upon thesurface of a substrate plate which is made from, for example, glass orplastic or the like in a predetermined array configuration such as a socalled stripe array, delta array, or mosaic array or the like.

Furthermore, a full color display upon such an electroluminescent deviceis provided by, for example, arranging electroluminescent layers ofvarious colors such as R (red), G (green), and B (blue) in dot form uponthe surface of a substrate plate which is made from, for example, glassor plastic or the like in a predetermined array configuration such as aso called stripe array, delta array, or mosaic array or the like, andsandwiching these electroluminescent layers between pairs of electrodesso as to form picture elements (pixels). And, by controlling the voltagewhich is applied between these electrodes for each picture elementpixel, a full color display is provided by causing light of the desiredcolors to be emitted from these picture elements.

In the past, there has been a per se known method of usingphotolithography when patterning the filter elements of a color filterof various colors such as R, G, and B, or when patterning the pictureelements of an electroluminescent device of various colors such as R, G,and B. However there are certain problems when using thisphotolithography method, such as the fact that the process iscomplicated, the fact that large quantities of the color material or thephotoresist are consumed, the fact that the cost becomes high, and thelike.

In order to solve this problem, a method has been contemplated offorming a filament or an electroluminescent layer or the like as a dotform array by discharging in dot form a filter element material or anelectroluminescent material by an ink jet method.

Now, a method of making a filament or an electroluminescent layer or thelike as a dot form array by an ink jet method will be explained. Thecase will be considered in which, as shown in FIG. 29(a), a plurality offilter elements 303 which are arrayed in dot form are formed, based uponan ink jet method, upon the internal regions of a plurality of panelregions 302 shown in FIG. 29(b) which are established upon the surfaceof a so called motherboard 301 which is a substrate plate of relativelylarge area which is made from glass, plastic or the like. In this case,as for example shown in FIG. 29(c), while performing a plurality ofepisodes of main scanning (in FIG. 29, two episodes) for a single panelregion 302, as shown by the arrow signs A1 and A2 in FIG. 29(b), with anink jet head which has a plurality of nozzles 304 which are arranged ina linear array so as to constitute a nozzle row 305, filter elements 303are formed in the desired positions by discharging ink, i.e. filtermaterial, selectively from this plurality of nozzles during these mainscanning episodes.

These filter elements 303 are ones which are formed by arraying variouscolors such as R, G, and B and the like as described above in a suitablearray form such as a so called stripe array, delta array, or mosaicarray or the like. Due to this, in the ink discharge processing by theink jet head 306 shown in FIG. 29(b), ink jet heads 306 for just thethree colors R, G, and B are provided in advance, so as to discharge thesingle colors R, G, and B. And a three color array including R, G, and Bor the like is formed upon the single motherboard 301 by using these inkjet heads 306 in order.

On the other hand, if a plurality of panel regions 302 are formed uponthe motherboard 301, then it has been contemplated to form the filterelement 303 at high efficiency by using an ink jet head of elongatedform so that the ink jet head is positioned along substantially theentire extent of the widthwise dimension of the motherboard 301, whichconstitutes its widthwise direction with respect to the main scanningdirection of the ink jet head. However there is the problem that, if amotherboard 301 is utilized whose size is different from and does notcorrespond to the size of the panel regions 302, every time thishappens, a different ink jet head comes to be required, and accordinglythe cost is increased.

Because the ink jet head has a mechanism in which ink is pressurized bya pressing means, for instance a piezo electric crystal, it is necessarywirings through which signal to drive the piezo electric crystal passes.According to the above necessity, a head device which comprises a boardon which a ink jet head and a connector by which a circuit for drivingthe ink jet head are integrally mounted is utilized.

However, it is necessary to consider a working efficiency in wiring theink jet heads, a layout of the head devices so as to obtain a desiredprint pattern, and an noise prevention in designing an arrangement ofthe head devices.

SUMMARY OF THE INVENTION

The present invention has been conceived in view of the above describedconsiderations, and its objective is to provide: a liquid drop dischargedevice and a discharge method which are prevented from being influencedby an electrical noise and are easy in a construction, a electro opticaldevice, a method and device of manufacture thereof, a color filter, amethod and device of manufacture thereof, a device incorporatingbacking, a method and device of manufacture thereof.

(1) A discharge device according to the present invention proposes aplurality of discharge means each of which comprises a liquid dropdischarge head provided with nozzles which discharge liquid mass havinga certain flowability onto an object onto which liquid drops are to bedischarged, a mounting board on which the liquid drop discharge head ismounted, and a connector which is arranged on the mounting board, aholding means on which the plurality of discharge means are arranged;and a shifting means for relatively shifting at least one of thisholding means and the object onto which liquid drops are to bedischarged. According to an aspect of the present invention, theplurality of discharge means are aligned to be separated into groups ofdischarge means and the discharge means in one of the groups areorientated so that their connectors do not face the discharge means inthe other of the groups, and so as to orientate a plane, on which thenozzles of the liquid drop discharge heads are aligned, to face asurface of the object onto which liquid drops are to be discharged at apredetermined distance.

With the present invention having the above structure, because theplurality of discharge means, which comprise the liquid drop dischargeheads and connectors on the mounting board, are arranged on holdingmeans, it becomes to be easier to compose the discharge device, and theproductivity of manufacturing the discharge device increases. Becausethe connectors of one the groups do not face the discharge means in theother of the groups, a portion of the mounting board of one of thegroups on which the connectors are arranged is orientated to an outerside of the mounting board where opposes to the liquid drop dischargehead of the other of the groups, and therefore an efficiency of wiringto the connectors increases. According to the discharge means thuswired, because a mutual influence among the electrical noise from theconnectors is prevented, the discharge of the liquid mass is stabilized.

It is desirable for the discharge means of the present invention to formthe mounting board in a rectangular shape and also to provide a liquiddrop discharge head in one longitudinal end of the mounting board and aconnector in another longitudinal end of the mounting board. Due to theabove construction, it becomes easier to layout the plurality ofdischarge means so that the portion on which the connectors of one ofthe groups are arranged does not face to the discharge means of theother of the groups and directs outer side which opposes to a directionto face to the liquid drop discharge head of the other of the groups.And therefore the discharge device is in a state in which the connectersof one of the groups are apart from the discharge heads of the other ofthe groups and an efficiency for wiring the connectors and a workingrate for wiring the connectors increase.

It is desirable for the discharge means of one of the groups, which isorientated so that the portion in which the connectors are arranged doesnot face to the discharge means of the other of the groups, to bearranged so that the discharge means of one of the groups are arrangedpoint symmetrically with the discharge means of the other of the groups.Due to the above construction, the connectors of the one of the groupsare located in a position which is farthest from the connectors of theother of the groups, which are arranged point symmetrically with theother of the groups, and therefore, a efficiency of wiring increases andinfluences of electrical noise decrease.

It is desirable for the discharge means to further comprise a liquidsupplying means which supplies liquid mass to the discharge means, theliquid supplying means connects a supply tube from positions between thegroups of discharge means to each of the discharge means in each groupof discharge means so as to supply the liquid mass to each of thedischarge means. Due to the above constructions, the liquid mass issupplied through the supply tube from the positions between the groupsof discharge means to each of the discharge means, and the supply tubesthrough which the liquid mass flows are combined as a single line in anintermediate position of the each tubes. Therefore an efficiency ofpiping for the tubes and an efficiency of a maintenance thereofincrease. Further, a displacement and a damage of the tubes due to aninterference among the one of the tubes and other of the tubes.

It is desirable for the liquid supplying means to comprise a tank whichstores the liquid mass, a supplying tube through which the liquid massflows, a pump which supplies the liquid mass in the tank to the liquiddrop discharge head of the liquid discharge means through the supplytube, a plurality of the supply tubes are provided for each of theliquid drop discharge heads and which piping paths are located frompositions between the groups of discharge means to each of the dischargemeans. Because the supplying tubes through which the liquid mass flowsare located from positions between the groups of discharge means to eachof the discharge means, in a piping by which the liquid is distributed,a flow resistance in one of the supplying tubes equals to the other ofthe supplying tubes. A discharge rate of one of the supplying tubesequals to a discharge rate of the other of the supplying tubes whichdimensions are same as one of the supplying tubes. Because a commonlydischarge is established by supplying tubes having same dimensions, aproductivity of the discharge device increases.

It is desirable for the discharge device to comprise a plurality ofwirings which connects a control means to the connectors of thedischarge means, wherein the plurality of wirings are wired from anouter periphery of the holding means to the connectors. Because theplurality of wirings are wired from an outer periphery of the holdingmeans to the connectors, influences of one of the wirings to the otherare prevented, and it is possible to stably discharge the liquid mass.

It is desirable for the discharge device to comprise a plurality ofdischarge heads which are aligned along a plurality of lines whichintersect to a direction along which the liquid drop discharge heads areshifted relative to the surface of the object onto which liquid dropsare to be discharged. According to such a structure, the liquid dropdischarge heads are arranged so that the liquid drop discharge heads areinclined with respect to a direction along which the liquid dropdischarge means are shifted in order to set the pitch, i.e. theinterval, between the nozzles relative to the pitch at which the liquidmass is discharged, and an interference between various one of thedischarge means to the other of the discharge means next to the variousone of the discharge means is prevented. Therefore, a productivity ofthe discharge device increases and an influence of an electric noise isprevented.

(2) With the present invention, it is convenient to manufacture anelectro optical device by forming an electro-luminescent layer by, withthe liquid mass which is to be discharged being a liquid mass whichincludes an electro-luminescent material, discharging this liquid massagainst, as the object against which liquid drops are to be discharged,a substrate plate.

(3) With the present invention, it is convenient to manufacture a colorfilter which is an electro optical device by, with the liquid mass whichis to be discharged being a liquid mass which includes a color filtermaterial, discharging this liquid mass against, as the object againstwhich liquid drops are to be discharged, one of a pair of substrateplates between which a liquid crystal is to be sandwiched.

(4) With the present invention, it is convenient to manufacture colorfilters of various colors by, with the liquid mass which is to bedischarged being a liquid mass which includes a color filter material,discharging this liquid mass against a substrate as the object againstwhich liquid drops are to be discharged.

(5) With the present invention, it is convenient to manufacture a devicewhich comprises a backing, wherein a predetermined layer is formed uponthe backing by discharging a liquid mass which is endowed with a certainflowability against the backing, which is the object onto which liquiddrops are to be discharged, by a discharge method of one of the typesdescribed above.

According to the present invention, the discharge means, comprising theliquid drop discharge heads and the connectors being arranged on themounting board, are separated into the groups and mounting board isorientated so that the portion the on which the connectors of one of thegroups are arranged does not face to the discharge means of the other ofthe groups, and the liquid drop discharge head is shifted relative tothe object onto which liquid drops are to be discharged while a plane inwhich the nozzles are aligned lays along the surface of the object ontowhich liquid drops are to be discharged so as to discharge the liquidmass to the object onto which liquid drops are to be discharged,therefore, it is possible to construct the discharge means easiercompared with respectively constructing the plurality of liquid dropdischarge means with corresponding connectors and also possible toincrease a manufacturing efficiency. And the mounting board isorientated so that the portion on which the connectors of one of thegroups are arranged does not face to the discharge means of the other ofthe groups, and the portion on which the connectors are arranged isorientated so that the portion faces to the outer periphery of themounting board which is opposite with the liquid drop discharge head,and therefore, it is possible to easily wire the connectors and also toincrease a manufacturing efficiency. Further, by the connectors thusarranged in the discharge means it is possible to prevent a noise fromone of the connectors which influences to the other of the connector andalso possible to stably discharge the liquid mass.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a liquid drop discharge processingdevice of a liquid drop discharge device of a device for manufacture ofa color filter according to the present invention, with a portionthereof cut away.

FIG. 2 is a plan view showing a head unit of the same liquid dropdischarge processing device.

FIG. 3 is a side view of the same.

FIG. 4 is an elevation view of the same.

FIG. 5 is a sectional view of the same.

FIG. 6 is an exploded perspective view of the same head device.

FIG. 7 is an exploded perspective view of the same ink jet head.

FIGS. 8(A) thorough 8(C) are a set of explanatory views for explanationof the operation of the same ink jet head for discharging filter elementmaterial.

FIG. 9 is an explanatory view for explanation of the discharge amount offilter element material by the same ink jet head.

FIG. 10 is a schematic view for explanation of the way in which the sameink jet head is arranged.

FIG. 11 is a partially magnified schematic view for explanation of theway in which the same ink jet head is arranged.

FIG. 12(A) is a general figure showing a color filter which has beenmanufactured by the same device for manufacturing a color filter, and isa plan view of the color filter

FIG. 12(B) is a sectional view taken in a plane given by the arrows X-Xin its view FIG. 12(A).

FIG. 13 is a manufacturing process sectional view for explanation of theprocedure for manufacturing this color filter.

FIG. 14 is a circuit diagram showing one portion of a display devicewhich employs an electro-luminescent display element which is an electrooptical device according to the present invention.

FIG. 15 is a magnified plan view showing the planar structure of apicture element region of the same display device.

FIGS. 16(A) through 16(E) are a manufacturing process sectional viewshowing a procedure for preliminary processing of the process ofmanufacture of the same display device.

FIGS. 17(A) through 17(C) are a manufacturing process sectional viewshowing a procedure for discharge of electro-luminescent material in theprocess of manufacture of the same display device.

FIGS. 18(A) through 18(D) are another manufacturing process sectionalview showing a procedure for discharge of electro-luminescent materialin the process of manufacture of the same display device.

FIG. 19 is a sectional view showing a picture element region of adisplay device which employs an electro-luminescent display elementwhich is an electro optical device according to the present invention.

FIG. 20(A) is a magnified figure showing the structure of a pictureelement region of a display device which employs an electro-luminescentdisplay element which is an electro optical device according to thepresent invention and shows the planar structure thereof.

FIG. 20(B) is a sectional view taken in a plane shown by the arrows B-Bin its view 20(A).

FIG. 21 is a manufacturing process sectional view showing a process ofmanufacture for manufacturing a display device which employs anelectro-luminescent display element which is an electro optical deviceaccording to the present invention.

FIG. 22 is another manufacturing process sectional view showing aprocess of manufacture for manufacturing a display device which employsan electro-luminescent display element which is an electro opticaldevice according to the present invention.

FIG. 23 is yet another manufacturing process sectional view showing aprocess of manufacture for manufacturing a display device which employsan electro-luminescent display element which is an electro opticaldevice according to the present invention.

FIG. 24 is still yet another manufacturing process sectional viewshowing a process of manufacture for manufacturing a display devicewhich employs an electro-luminescent display element which is an electrooptical device according to the present invention.

FIG. 25 is yet a further manufacturing process sectional view showing aprocess of manufacture for manufacturing a display device which employsan electro-luminescent display element which is an electro opticaldevice according to the present invention.

FIG. 26 is a still yet further manufacturing process sectional viewshowing a process of manufacture for manufacturing a display devicewhich employs an electro-luminescent display element which is an electrooptical device according to the present invention.

FIG. 27 is a perspective view showing a personal computer which is anelectronic device equipped with the same electro optical device.

FIG. 28 is a perspective view showing a portable telephone which is anelectronic device equipped with the same electro optical device.

FIGS. 29(A) through 29(C) are figures showing one example of a method ofmanufacture of a prior art color filter.

FIG. 30(A) is a view showing a display device according to anotherpreferred embodiment of the electro optical device according to thepresent invention, and is a schematic plan view.

FIG. 30(B) is a sectional schematic figure taken in a plane shown by thearrows AB in its view FIG. 30(A).

FIG. 31 is a view showing an essential portion of the same displaydevice.

FIG. 32 is a process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 33 is another process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 34 is a schematic plan view showing one example of a plasmaprocessing device which is utilized in the manufacture of the samedisplay device.

FIG. 35 is a schematic view showing an internal structure of a firstplasma processing chamber of the plasma processing device shown in FIG.34.

FIG. 36 is a process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 37 is another process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 38 is a schematic plan view showing another example of a plasmaprocessing device which is utilized in the manufacture of the samedisplay device.

FIG. 39 is a plan view showing a liquid drop discharge device which isutilized in the manufacture of the same display device.

FIG. 40 is a plan view showing the state in which an ink jet head isarranged upon a base member.

FIGS. 41(A) through 41(C) are process diagrams for explanation of aprocess when forming a positive hole injection and transport layer witha first scan of an ink jet head.

FIGS. 42(A) through 42(C) are process diagrams for explanation of aprocess when forming a positive hole injection and transport layer witha third scan of an ink jet head.

FIGS. 43(A) through 43(C) are process diagrams for explanation of aprocess when forming a positive hole injection and transport layer witha second scan of an ink jet head.

FIG. 44 is a process diagram for explanation of the method ofmanufacture of a display device which is another embodiment of anelectro optical device according to the present invention.

FIG. 45 is a process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 46 is a process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 47 is another process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 48 is yet another process diagram for explanation of the method ofmanufacture of the same display device.

FIG. 49 is still yet another process diagram for explanation of themethod of manufacture of the same display device.

FIG. 50 is a figure showing the sectional structure of a liquid crystaldevice which is equipped with a color filter which is made by themanufacturing device according to the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

—A Preferred Embodiment Related to a Method of Manufacture of a ColorFilter, and a Device for Manufacturing the Same—

Next, a preferred embodiment of the device for manufacture of a colorfilter according to the present invention will be explained withreference to the figures. First, before explaining this device formanufacture of a color filter, the color filter which is to bemanufactured will be explained. FIG. 12 is a figure which shows aportion of the color filter in a magnified view; its view 12(A) shows aplan view thereof, while the view 12(B) shows a sectional view thereoftaken in a plane shown by the line X-X in FIG. 12(A). It should beunderstood that, with this color filter shown in FIG. 12, the portionsfor which the structure is the same as that of corresponding portions inthe color filter of the preferred embodiment shown in FIG. 5 aredesignated by the same reference symbols.

—Construction of the Color Filter—

First, a preferred embodiment of a color filter manufactured by amanufacturing device according to the present invention will beexplained with reference to the figures. FIG. 12 is a partiallymagnified view of the color filter, and FIG. 12(A) is a plan view of thecolor filter and FIG. 12(B) is a sectional view taken in a plane givenby the arrows X-X in its view 12(A).

—Structure of the Color Filter—

Referring to FIG. 12(A), the color filter 1 comprises a plurality ofpicture elements 1A arranged in the form of a matrix. The boundaries ofthese picture elements 1A are defined by division walls 6. Color filterelement material 13, i.e. color filter material which is a liquid masswhich is either red (R), green (G), or blue (B) ink, is distributed intoeach one of these picture elements 1A. Although, in the followingexplanation of this color filter which is shown in FIG. 12, it will beassumed that the red, green, and blue picture elements are arranged in aso called mosaic array, this is not intended to be limitative: the sameexplanation would also apply in the case of a stripe array, a deltaarray or the like being utilized for the arrangement of the pictureelements.

The color filter 1, as shown in FIG. 12(B), comprises a transparentsubstrate plate 2 and transparent division walls 6. The portions wherethese division walls 6 are not formed, in other words the portions wherethey are eliminated, constitute the above described picture elements 1A.The filter element material 13 of various colors which is supplied intothese picture elements 1A constitute the filter elements 3 of variousadhered color layers. A protective layer 5 and an electrode layer 5 areformed over the upper surfaces of the division walls 6 and the filterelements 3.

—Structure of the Device for Manufacture of the Color Filter—

Next, the structure of a device for manufacturing the above describedcolor filter will be explained with reference to the drawings. FIG. 1 isa perspective view showing a liquid drop discharge processing device ofa device for manufacturing the color filter according to the presentinvention with one portion thereof cut away.

This device for manufacture of a color filter is adapted to manufacturea color filter which is to be incorporated in a color liquid crystalpanel, which constitutes an electro optical device. This device formanufacture of a color filter comprises a liquid drop discharge devicewhich is not shown in the figures.

—Structure of the Liquid Drop Discharge Processing Device—

And this liquid drop discharge device comprises three individual liquiddrop discharge processing devices 405R, 405G, and 405B, as shown in FIG.1, in the same manner as the liquid drop discharge devices of thevarious preferred embodiments described above. These liquid dropdischarge processing devices 405R, 405G, and 405B correspond to thethree colors R (red), G (green), and B (blue) of the filter elementmaterials 13 of, for example, R, G, and B colors, which are the colorfilter materials, in other words the inks, which are to serve as liquidmasses for being discharged against the motherboard 12. It should beunderstood that these liquid drop discharge processing devices 405R,405G, and 405B are arranged approximately in series, thus making up theliquid drop discharge device. Furthermore, a control device forcontrolling the operation of various structural members, not shown inthe figures, is provided integrally with each of the liquid dropdischarge processing devices 405R, 405G, and 405B.

Moreover, it should be understood that each of the liquid drop dischargeprocessing devices 405R, 405G, and 405B is connected to an individualtransportation robot not shown in the drawings, each of which insertsand takes out motherboards 12, one at a time, into and from itsrespective liquid drop discharge processing devices 405R, 405G, and405B. Furthermore, to each of the liquid drop discharge processingdevices 405R, 405G, and 405B there is connected a multi stage bakingfurnace, not shown in the drawings, which is capable of accommodating,for example, six of the motherboards 12 at a time, and which subjectsthe motherboards 12 to heat processing by heating them up, for exampleat a temperature of 120 degree Celsius for a period of five minutes, fordrying out the filter element material 13 which has been dischargedagainst the motherboards 12.

And, as shown in FIG. 1, each of the liquid drop discharge processingdevices 405R, 405G, and 405B comprises a thermal clean chamber 422 whichis a hollow box shaped main body casing. In order to obtain properlystabilized painting by the ink jet method, the temperatures of theinteriors of these thermal clean chambers 422 are adjusted to, forexample, 20±0.5 degree Celsius, and they are formed so that dust or dirtcannot insinuate itself into them from the outside. The liquid dropdischarge processing device main bodies 423 are housed within thesethermal clean chambers 422.

The liquid drop discharge processing device main body 423 comprises an Xaxis air slide table 424, as shown in FIG. 1. A main scanning drivedevice 425, to which a linear motor not shown in the figures isprovided, is disposed upon this X axis air slide table 424. This mainscanning drive device 425 comprises a pedestal portion not shown in thefigures to which the motherboard 12 is fixedly attached by, for example,suction, and this pedestal portion is shifted in the main scanningdirection, which is the X axis direction, with respect to themotherboard 12.

As shown in FIG. 1, a widthwise scanning drive device 427 which servesas a Y axis table is disposed in the liquid drop discharge processingdevice main body 423 as positioned above the X axis air slide table 424.A head unit 420 which discharges filter element material 13, forexample, in the vertical direction is shifted by this widthwise scanningdrive device 427 along the widthwise scanning direction with respect tothe motherboard 12, which is the Y axis direction. It should beunderstood that, in FIG. 1, the head unit 420 is shown by solid lines inits state in which it floats in the air, in order to clarify the variouspositional relationships.

Furthermore various cameras not shown in the drawings are provided inthe liquid drop discharge processing device main body 423, and these areposition detection means which detect various positions of variouselements, for controlling the position of the ink jet head 421 and/orthe position of the motherboard 12. It should be understood that it ispossible to implement position control of the head unit 420 or of thepedestal portion by position control using pulse motors, or by feedbackcontrol using servo motors, or by some other control method, as may beappropriate.

Furthermore, as shown in FIG. 1, a wiping unit 481 which wipes off thesurface of the head unit 420 which discharges filter element material 13is provided to the liquid drop discharge processing device main body423. In this wiping unit 481, a wiping member not shown in the figuresin which, for example, a cloth member and rubber sheet are integrallysuperimposed is appropriately wound up from its one end, and the wipingunit 481 is arranged to wipe the surface which discharges filter elementmaterial 13 using new surfaces of this wiping member in order. By doingthis, elimination of filter element material 13 which has adhered to thedischarge surface is performed, and it is possible to prevent theoccurrence of blockages of certain nozzles, which will be describedhereinafter, in the surface which discharges filter element material 13.

Furthermore, as shown in FIG. 1, an ink system 482 is provided to theliquid drop discharge processing device main body 423. This ink system482 comprises an ink tank 483 which stores filter element material 13, asupply conduit 478 which is capable of conducting this filter elementmaterial 13, and a pump not shown in the drawings which supplies filterelement material 13 to the head unit 420 from the ink tank 483 via thesupply conduit 478. It should be understood that the piping of thesupply conduit 478 is only shown schematically in FIG. 1, and it isconnected to the side of the widthwise scanning drive device 427 so asnot to exert any influence from the ink tank 483 upon the shifting ofthe head unit 420, and so as to supply filter element material 13 to thehead unit 420 from the vertical direction of the widthwise scanningdrive device 427 which drives the head unit 420 to perform scanning.

Furthermore, a weight measurement unit 485 which detects the amount ofdischarge of filter element material 13 from the head unit 420 isprovided to the liquid drop discharge processing device main body 423.

Yet further, a pair of dot missing detection units 487 are provided tothe liquid drop discharge processing device main body 423, and these dotmissing units 487 comprise, for example, optical sensors not shown inthe drawings which detect the discharge state of filter element material13 from the head unit 420. Moreover, these dot missing detection units487 are arranged so that light sources and light reception portions oftheir optical sensors not shown in the figures are arranged along acrossing direction with respect to the direction in which the liquidmass is discharged from the head unit 420, for example along the X axisdirection, and lie on either side of, and mutually oppose one anotheracross, the space through which the liquid drops which have beendischarged from the head unit 420 pass. Furthermore, these dot missingdetection units 487 are arranged so as to be positioned on the Y axisdirection side which is the transport direction of the head unit 420,and they detect dot missing by, for each episode of widthwise scanningshifting, detecting the discharge state of the head unit 420 fordischarging the filter element material 13.

Although the details thereof will be described hereinafter, it should beunderstood that two rows of the head device 433 which discharges filterelement material 13 are provided to the head unit 420. Due to this, apair of the dot missing detection units 487 are also provided fordetecting the discharge state, one for each row of these head devices.

—Structure of the Head Unit—

Next, the structure of the head unit 420 will be explained. FIG. 2 is aplan view showing the head unit 420, which is provided in each of theliquid drop discharge processing devices 405R, 405G, and 405B. FIG. 3 isa side view of this head unit 420.

FIG. 4 is an elevation view of this head unit 420. And FIG. 5 is asectional view showing this head unit 420.

As shown in FIGS. 2 through 5, the head unit 420 comprises a head mainbody portion 430 and an ink supply section 431. Furthermore, this headmain body portion 430 comprises a planar carriage 426 and a plurality ofhead devices 433 fitted upon this carriage 426, all of which are, inpractice, of roughly the same structure.

—Structure of the Head Device—

FIG. 6 is an exploded perspective view showing a head device 433 whichis provided to the head unit 420.

As shown in FIG. 6, this head device 433 comprises a print substrateplate 435 which has a shape of rectangular card. Electrical connectingwires which connect various electrical components 436 are provided uponthis print substrate plate 435. Furthermore, a window portion 437 isformed through the print substrate plate 435, positioned at one endthereof (the right end in FIG. 6) along its longitudinal direction. Yetfurther, flow conduits 438 which are capable of carrying flows of filterelement material 13, i.e. of ink, are provided in the print substrateplate 435 and are positioned at opposite sides of the window portion437.

And an ink jet head 421 is integrally fitted by a fitting member 440upon one surface side (the lower surface side in FIG. 6) of this printsubstrate plate 435, and is positioned approximately at one end thereofin its longitudinal direction (the right end in FIG. 6). This ink jethead 421 is formed in an elongated parallelepiped shape, and it is fixedto the print substrate plate 435 with its lengthwise direction runningalong the lengthwise direction of the plate 435. It should be understoodthat each of the ink jet heads 421 of each of the head devices 433 is inpractice of approximately the same type, in other words, for example,may be a product made to a predetermined standard, or may be sorted to apredetermined quality, or the like. In concrete terms, each of these inkjet heads 421 comprises the same number of nozzles which will bedescribed hereinafter, and it is desirable for the positions in whichthese nozzles are formed to be mutually the same, so that it is possibleefficiently to perform the operation of assembling these ink jet heads421 to the carriage 426, and so that, furthermore, it is possible toenhance the accuracy of that operation. Yet further, it is possible toreduce the cost if components are utilized which are produced via thesame manufacturing and assembly process, since the requirement formanufacturing special components disappears.

Furthermore, connectors 441 for electrically connecting electricalconnecting wires 442 to the ink jet head 421 are integrally fitted onthe other surface side of the print substrate plate 435 (the upper sidein FIG. 6), so as to be positioned approximately at the other endthereof (the left end in FIG. 6) in its longitudinal direction. Asschematically shown in FIG. 1, electrical connecting wires 442(including connecting wires from an electrical power source andconnecting wires for carrying signals) which are connected to thewidthwise scanning drive device 427 are connected to these connectors441, so as not to exert any influence upon the shifting of the head unit420. These connecting wires 442 are connected to a control device notshown in the figures, and to the head unit 420. In other words theseelectrical connecting wires 442, as schematically shown by the doubledotted broken arrows in FIG. 2 and FIG. 5, are connected from thewidthwise scanning drive device 427 to the connectors 441 which areconnected to the outer peripheral sides of the head unit 420, which areon opposite sides of the direction (the longitudinal direction) in whichthe two rows of head device 433 of this head unit 420 are aligned, andthereby the generation of electrical noise is minimized.

Yet further, an ink supply section 443 is fitted to the other surfaceside of the print substrate plate 435 (the upper surface side in FIG.6), approximately at one end thereof (the right end in FIG. 6) in itslongitudinal direction, so as to correspond to the ink jet head 421.This ink supply section 443 comprises position determination tubularportions 445 of roughly cylindrical form which pass through the printsubstrate plate 435 and into which position determination pin portions444 which are provided upon the fitting member 440 are fitted, andengagement claw portions 446 which engage with the print substrate plate435.

Moreover a pair of connecting members 448 are provided so as to projectfrom the ink supply section 443, and these members 448 are ofapproximately cylindrical form and have tapered ends. These connectingmembers 448 have through openings not shown in the figures which, attheir base end portions which are presented towards the print substrateplate 435, connect in a substantially liquid tight manner to the flowconduits 438 of the print substrate plate 435, and their tip endportions (at their upper ends in FIG. 6) are provided with holes notshown in the figures through which flows of filter element material 13may be conducted.

Still further, as shown in FIGS. 3 through 6, a sealing connectingmember 450 is fitted to each to these connecting members 448, positionedat its tip. These sealing connecting members 450 are made in roughlycylindrical form, and their interior circumferences are fitted to theconnecting members 448 in a substantially liquid tight fashion; and theyare provided with seal members 449 at their tip end portions.

—Structure of the Ink Jet Head—

FIG. 29 is an exploded perspective view showing the ink jet head 421.FIG. 8 consists of schematic sectional views of the ink jet head 421 forexplanation of the operation of the ink jet head 421 for discharge offilter element material 13, and, in detail, FIG. 8(A) shows the state ofthe ink jet head 421 before discharging filter element material 13, FIG.8(B) shows its state when discharging filter element material 13 bycontracting a piezoelectric drive element 452, and FIG. 8(C) shows itsstate directly after having discharged filter element material 13. FIG.9 is an explanatory view for explanation of the discharge amount offilter element material by the ink jet head 421. And FIG. 10 is anoverall schematic view for explanation of the situation of arrangementof the ink jet head 421. Moreover, FIG. 11 is a magnified view showing aportion of FIG. 10.

The ink jet head 421, as shown in FIG. 7, comprises a roughlyrectangular shaped holder 451. In this holder 451 there are provided tworows of piezoelectric drive elements 452 which extend along thelongitudinal direction, each including, for example, 180 individualpiezo elements. Furthermore, through holes 453 are provided in theholder 451, roughly on both sides thereof in the center, for conductingflows of the filter element material 13, i.e. of the ink, and thesethrough holes 453 connect to the flow conduits 438 of the printsubstrate plate 435.

Furthermore, as shown in FIG. 7, an elastic plate 455 which is made fromcomposite resin in the form of a sheet is integrally provided upon theupper surface of the holder 451, which is the surface upon which thepiezoelectric drive elements 452 are positioned. Communicating holes 456which connect to the through holes 453 are provided upon this elasticplate 455. And engagement holes 458 are provided through this elasticplate 455 for engagement with position determination claw portions 457which project from the upper surface of the holder 451, approximately atits four corners, so as to fix the position of the elastic plate 455upon the upper surface of the holder 451 and to hold it integrallythereupon.

Furthermore, a planar flow conduit definition plate 460 is provided uponthe upper surface of the elastic plate 455. In this flow conduitdefinition plate 460 there are provided: two rows of nozzle grooves 461,each formed as a line extending in the longitudinal direction of theholder 451 of 180 elements, elongated in the width direction of theholder 451, which correspond to the piezoelectric drive elements 452;two opening portions 462 which are provided in elongated form in thelongitudinal direction of the holder on either side of these nozzlegrooves 461; and two flow apertures 463 which connect to thecommunicating holes 456 of the elastic plate 455. And engagement holes458 are provided in this planar flow conduit definition plate 460 forengagement with the position determination claw portions 457 whichproject from the upper surface of the holder 451 approximately at itsfour corners, and thereby the planar flow conduit definition plate 455is fixed upon the upper surface of the holder 451 and is held integrallythereupon, along with the elastic plate 455.

Furthermore, a roughly planar nozzle plate 465 is provided upon theupper surface of the flow conduit definition plate 460. And two nozzlerows are provided in this nozzle plate 465 to extend in the longitudinaldirection of the holder 451, each of these two rows, in this example,being about 25.4 mm (1 inch) long, and consisting of 180 roughlycircular shaped nozzles 466 which correspond to the nozzle grooves 461which are formed in the flow conduit definition plate 460. Andengagement holes 458 are provided in the nozzle plate 465 for engagementwith the position determination claw portions 457 which project from theupper surface of the holder 451 approximately at its four corners, andthereby this nozzle plate 465 is fixed upon the upper surface of theholder 451 and is held integrally thereupon, along with the elasticplate 455 and the planar flow conduit definition plate 460.

And, as schematically shown in FIG. 8, along with a liquid reservoir 467being defined, by the elastic plate 455, the flow conduit definitionplate 460 and the nozzle plate 465, as a compartment at the openingportions 462 of the flow conduit definition plate 460, this liquidreservoir 467 is connected via a liquid supply conduit 468 to each ofthe nozzle grooves 461. Due to this, the ink jet head 421 operates thepiezoelectric drive elements 452 to magnify the pressure within thenozzle grooves 461, and discharges filter element material 13 from thenozzles 466 at a speed of 7±2 m/sec as liquid drops of mass 2-13 pl, forexample about 10 pl. In other words, referring to FIG. 8, by supplying apredetermined supply voltage Vh in the form of pulses to thepiezoelectric drive element 452, as shown in order in FIGS. 8(A), 8(B),and 8(C), the piezoelectric drive elements 452 are appropriatelyexpanded and contracted along the direction of the arrow Q, and therebypressure is applied to the filter element material 13, in other words tothe ink, so as to discharge the filter element material from the nozzles466 as liquid drops 8 of a predetermined mass.

Furthermore, with this ink jet head 421, as has also been explained withregard to the above described preferred embodiments, it may happen thatthe discharge amount at either or both of the end portions of the nozzlerows along the direction in which they extend may become great as shownin FIG. 9, so that undesirable deviations may occur in the amount ofdischarge. Due to this, control is exerted so as not to discharge filterelement material 13 from the nozzles 466 for which the undesirabledeviations of the discharge amounts are to be restrained within a rangeof, for example, 5%, in other words from about 10 of the nozzles 466 ateach end of each row.

And, as shown in FIG. 1 through FIG. 5, the head main body portion 430which is included in the head unit 420 comprises a plurality of headdevices 433 which comprise ink jet heads 421, mutually arranged in arow. The arrangement of these head devices 433 upon the carriage 426 isthat, as schematically shown in FIG. 10, they are arrayed generallyalong the Y axis direction which is the widthwise scanning direction,while being offset along a direction which is inclined with respect tothe X axis direction, which is the main scanning direction and isperpendicular to the Y axis direction. In other words, for example, sixsuch head devices 433 are arranged in a row in a direction which issomewhat inclined from the Y axis direction which is the widthwisescanning direction, and several such rows are provided, for example tworows. This is a method for arrangement which has been conceived of dueto the circumstance that it is necessary for the rows of nozzles 466 tobe arrayed in a continuous series along the Y axis direction, while onthe other hand it is not possible to shorten the space left open betweeneach ink jet head 421 and the next one neighboring it, since the widthin the longer direction of the head devices 433 is greater than that ofthe ink jet heads 421.

Furthermore, in the head main body portion 430, the head devices 433 arearranged roughly in point symmetry, with the longitudinal directions ofthe ink jet heads 421 being inclined to the direction (the Y axisdirection) which is perpendicular to the X axis direction, and moreoverwith the connectors 441 being positioned at the opposite side to therelatively opposing direction. These head devices 433 may be arranged sothat the direction of provision of their nozzles 466, which is thelongitudinal direction of the ink jet heads 421, is inclined at, forexample, 57.1 degree with respect to the X axis direction.

Furthermore, the head devices 433 are arranged in roughly a staggeredarrangement, in other words so that they are not positioned in a directseries along the direction in which they are arranged. In other words,as shown in FIGS. 2 through 5 and in FIG. 10, the ink jet heads 421 arearranged in two rows, with the nozzles 466 of the twelve (in thisexample) ink jet heads 421 being arranged continuously along the Y axisdirection, and moreover with the orders in which they are arranged alongtheir Y axis direction being arranged mutually differently, so that theyalternate.

This matter will now be explained in concrete terms and in more detail,based upon FIG. 10 and FIG. 11. Therein, on the ink jet head 421, thedirection in which the nozzles 466 are arrayed, which is thelongitudinal direction, is tilted with respect to the X axis direction.Due to this, a region A (a region of non-discharging nozzles), whichcomes to be positioned within the ten nozzles which do not discharge onthe other second row of the nozzles 466, is present (A in FIG. 11) uponthe straight line in the X axis direction upon which the eleventh nozzle466 in the first row among the two rows of nozzles 466 which areprovided to the ink jet head 421, and which discharges filter elementmaterial 13, is positioned. In other words, with a single ink jet head421, a region A occurs in which no two discharge nozzles 466 are presentupon a straight line in the X axis direction.

Accordingly, as shown in FIG. 10 and FIG. 11, no other head devices 433which form the row are positioned in a parallel state along the X axisdirection over the region B (B in FIG. 11) in which two dischargenozzles 466 of a single ink jet head 421 are positioned upon a straightline in the X axis direction. Furthermore, the region A of a head device433 which defines one row in which only one discharge nozzle 466 ispositioned upon the straight line in the X axis direction, and theregion A of a head device 433 which defines the other row in which onlyone discharge nozzle 466 is positioned upon the straight line in the Xaxis direction, are positioned in a state of being mutually parallel inthe X axis direction, while, with an ink jet head 421 of one row, and anink jet head 421 of the other row, the situation is that a total of twodischarge nozzles 466 are positioned upon a straight line in the X axisdirection.

In other words, over the region in which the ink jet heads 421 arearranged, they are arranged in a staggered manner (mutually differing)in two rows, so that, in whatever position, without any doubt, a totalof two of the nozzles 466 are positioned upon any line in the X axisdirection. It should be understood that the nozzles 466 in the regionsXX in which the nozzles 466 do not discharge filter element material 13are not counted as being included in the count of two nozzles 466 uponany straight line in the X axis direction.

In this manner, with regard to the X axis direction along which mainscanning is performed, two of the nozzles 466 which actually dischargeink are positioned upon a fictitious straight line which extends alongthe scanning direction (the straight line itself is not something whichactually exists); and, as will be described hereinafter, ink comes to bedischarged upon a single spot from both of these two nozzles 466. If asingle element is built up in this manner by discharge from severaldifferent ones of the nozzles 466, undesirable deviations of dischargebetween the various ones of the nozzles 466 are dispersed, and itbecomes possible to anticipate an evening of the characteristic betweenthe various elements and an enhancement of yield, since, when a singleelement is built up by discharge from only a single nozzle 466,undesirable deviations in the discharge amounts between different onesof the various nozzles 466 are linked with undesirable deviations in thecharacteristics of the elements and with a deterioration in the yield.

—Structure of the Ink Supply Section—

The ink supply section 431, as shown in FIGS. 2 through 5, comprises apair of planar fitting plates 471 which are provided to correspond tothe two rows of the head main body portions 430 respectively, and aplurality of supply main body portions 472 which are fitted to thesefitting plates 471. And the supply main body portions 472 comprisereciprocating portions 474 which are generally shaped as thin cylinders.These reciprocating portions 474 are fitted with a fitting jig 473 so asto pass through the fitting plates 471 and so as to be shiftable alongtheir axial directions. Furthermore, the reciprocating portions 474 ofthe supply main body portion 472 are fitted so as to be biased in thedirection to shift away from the fitting plate 471 towards the headdevice 433 by, for example, coil springs 475 or the like. It should beunderstood that, in FIG. 2, only one of the two rows of head devices 433is shown in the ink supply section 431, while the other of the rows ofhead devices 433 is omitted for the convenience of explanation.

Flange portions 476 are provided at the ends of these reciprocatingportions 474 which oppose the head device 433. These flange portions 476project like brims from the outer peripheral edges of the reciprocatingportions 474, and their end surfaces contact against the seal members449 of the ink supply section 443 of the head device 433, and areimpelled by the biasing action of the coil springs 475 so that they forma substantially liquid tight seal thereagainst. Furthermore, jointportions 477 are provided at the opposite end portions of thereciprocating portions 474 to the ends where the flange portions 476 areprovided. These joint portions 477 are connected to the one ends ofsupply conduits 478 which conduct flows of filter element material 13,as schematically shown in FIG. 1.

These supply conduits 478, as described above and as schematically shownin FIG. 1, are connected to the widthwise scanning drive device 427 soas not to influence the shifting of the head unit 420, and, asschematically shown by the single dotted broken lines in FIGS. 2 and 4,they are arranged from the widthwise scanning drive device 427 roughlycentrally between the ink supply sections 431 which are arranged in tworows upon the head unit 420, and furthermore their tip ends radiate outfrom the pipe-work and are connected to the joint portions 477 of theink supply sections 431.

And the ink supply sections 431 supply filter element material 13 whichis conducted via the supply conduits 478 to the ink supply sections 443of the head devices 433. Furthermore, the filter element material 13which is supplied to the ink supply sections 443 is supplied to the inkjet heads 421, is discharged in the form of appropriate liquid dropsfrom each of the nozzles 466 of the ink jet heads 421, according toelectrical control.

—Operation of Manufacture of the Color Filter—

—Preparatory Processing—

Next, the operation of manufacturing a color filter 1 using the abovedescribed device for manufacture of a color filter according to theabove described preferred embodiment of the present invention will beexplained with reference to the drawings.

FIG. 13 is a manufacturing process sectional view for explanation of theprocedure of manufacture of the color filter 1, using the abovedescribed device for manufacture of a color filter according to thispreferred embodiment.

First the surface of a motherboard 12, which is a transparent substrateplate made from non-alkaline glass of dimensions, for example, 0.7 mmthick, 38 cm high, and 30 cm wide, is cleaned with a cleaning fluidwhich is 1% by mass of hydrogen peroxide added to hot sulfuric acid.After this cleaning, the plate is rinsed with water and dried in air, sothat a clean surface is obtained. A chromium layer of average thickness0.2 μm is formed upon the surface of this motherboard 12 (in a procedureS1 in FIG. 13) by, for example, a spattering method, so as to obtain ametallic layer 6 a.

After drying this motherboard 12 upon a hot plate at a temperature of 80degree Celsius is for five minutes, a layer of photo-resist not shown inthe figures is formed upon the metallic layer 6 a by, for example, spincoating. A mask film not shown in the figures upon which is painted, forexample, a required matrix pattern is adhered upon the surface of thismotherboard 12, and the whole is then exposed to ultraviolet light.

Next, this motherboard 12 which has been thus exposed is immersed in,for example, an alkaline developing fluid which contains 8% by mass ofpotassium oxide, and the non-exposed portion of the photo-resist isthereby eliminated, so that the resist layer is patterned. Next, theexposed portion of the metallic layer 6 a is removed by etching with anetching liquid of which, for example, the main component is hydrochloricacid. By doing this, a reticulated light interception layer 6 b isobtained (in a procedure S2 in FIG. 13); this layer 6 b is in the formof a black matrix having the predetermined matrix pattern. It should beunderstood that the thickness of this light interception layer 6 b isabout 0.2 μm, while the widthwise dimension of the strands which make upthis light interception layer 6 b is about 22 μm.

Next, a negative type transparent acrylic type light sensitive resincomposition material layer 6 c is formed upon the motherboard 12equipped with this light interception layer 6 b by, for example, a spincoating method or the like (in a procedure S3 in FIG. 13). Afterpre-baking the motherboard 12 equipped with this light sensitive resincomposition material layer 6 c at a temperature of 100 degree Celsiusfor a period of 20 minutes, it is exposed to ultraviolet light using amask film not shown in the figures which is painted thereon in the formof a matrix pattern. And the non exposed portion of the resin isdeveloped by, for example, an alkaline developing fluid like the typedescribed above, and, after the work-piece has been rinsed with purewater, it is spin dried. After-baking is then performed at, for example,a temperature of 200 degree Celsius for a period of 30 minutes, andthereby, when the resin portion has been sufficiently cured, areticulated bank layer 6 d is formed. The thickness of this bank layer 6d may be, for example, an average of 2.7 μm, and the widthwise dimensionof the strands which make it up may be, for example, about 14 μm. Thedivision walls 6 are constituted (in a procedure S4 in FIG. 13) by thisbank layer 6 d and the light interception layer 6 b.

Next the work-piece is processed with dry etching, in other words withplasma processing, in order to improve the wettability by ink of thefilter element formation regions 7 (and particularly of the exposedsurfaces of the motherboard 12), which are the regions, destined foradhesion of a color filter material layer, into which the motherboardhas been compartmented by the light interception layer 6 b and the banklayer 6 d which have been produced as described above. In concreteterms, the preliminary processing process of the motherboard 12 iscompleted by forming a plasma processing etching spot in which a highvoltage is applied in a mixture gas consisting, for example, of heliumwith a 20% admixture of oxygen, and by passing the motherboard 12through this etching spot which has been formed and etching it.

—Discharge of the Filter Element Material—

Next, filter element material 13 of each of the colors red (R), green(G), and blue (B) is fed by an ink jet method into the filter elementformation regions 7 which have been defined by the division walls 6 bydividing up the motherboard 12 by the above described preliminaryprocessing which has been thus performed; in other words, ink isdischarged into these regions 7 (in a procedure S5 in FIG. 13).

When discharging this filter element material 13 by this ink jet method,the head unit 420 comprising the predetermined nozzle plate 465 of theabove described specification is made and assembled in advance. And, inthe liquid drop discharge devices of each of the liquid drop dischargeprocessing devices 405R, 405G, and 405B, the discharge amount of thefilter element material 13 which is discharged from a single one of thenozzles 466 of each of the ink jet heads 421 is adjusted to apredetermined amount, for example approximately 10 pl. On the otherhand, the division walls 6 are formed in advance upon the one surface ofthe motherboard 12 in a lattice pattern.

And, first, the motherboard 12 which has been subjected to the abovedescribed preliminary processing is transported by a transport robot notshown in the figures to the interior of the liquid drop dischargeprocessing device 405R for R color ink, and is placed upon the pedestalportion within this liquid drop discharge processing device 405R. Themotherboard 12 is then fixed in position upon this pedestal portion by,for example, suction, so that its position is positively determined. Andthe position of the motherboard 12 held upon the pedestal portion ischecked with various cameras and the like, and it is shifted by the mainscanning drive device 425 and is controlled so as to be regulated to asuitable predetermined position. Furthermore, the head unit is suitablyshifted by the widthwise scanning drive device 427, and its position isdetected. After this, the head unit 420 is shifted in the widthwisescanning direction, and the discharge state of from the nozzles 466 isdetected with the dot missing detection unit 487, and if it is detectedthat no improper discharge state is occurring, the head unit 420 isshifted into its initial position.

After this, the motherboard 12 is scanned in the X direction by the mainscanning drive device 425 while being held upon the movable pedestalportion, and appropriate filter element material 13 is discharged frompredetermined ones of the nozzles 466 of suitable ones of the ink jetheads 421 while shifting the head unit 420 relative to the motherboard12, and is filled into the concave portions into which the motherboard12 has been compartmented by the division walls 6. This discharge fromthe nozzles 466 is controlled by a control device not shown in thefigures, so as not to discharge filter element material 13 from thenozzles 466 which are positioned in a predetermined region X at both endportions in the direction in which the nozzles 466 shown in FIG. 11 arearranged, for example from the 10 nozzles 466 at each end of this rowarrangement, while on the other hand a comparatively uniform amount ofthe filter element material 13 is discharged from the 160 nozzles 466(for example) which are positioned at the central portion of this rowarrangement.

Furthermore, since two of the discharges from the nozzles 466 arepositioned upon a straight line in the scanning direction, in otherwords, since two of the nozzles 466 are positioned upon a singlescanning line, and since, during shifting, two dots—in more detail, twoliquid drops of filter material 13 as one dot from a single nozzle466—are discharged into a single concave portion (a single filterelement formation region 7), accordingly a total of eight liquid dropsare thus discharged. The state of discharge during each single episodeof shifting scanning is detected by the dot missing detection unit 487,and it is checked that no missing of dots is taking place.

If the occurrence of dot missing is detected, the head unit 420 isshifted by a predetermined amount in the widthwise scanning direction,and the operation of discharging filter element material 13 is againrepeated while shifting the pedestal portion which is holding themotherboard 12, so as to form the filter elements 3 in the predeterminedfilter element formation regions 7 of the predetermined color filterformation regions 11.

—Drying and Curing—

And, the motherboard 12 upon which the R color filter element material13 has been discharged is taken out from the liquid drop dischargeprocessing device 405R by a transport robot not shown in the figures,and then is put into a multi stage baking furnace also not shown in thefigures, in which the filter element material is dried by, for example,heating the motherboard 12 up to 120 degree Celsius for five minutes.After this drying, the motherboard 12 is taken out from the multi stagebaking furnace by a transport robot, and is transported while it coolsdown. After this, the motherboard is transported from the liquid dropdischarge processing device 405R in order to a liquid drop dischargeprocessing device 405G for G color filter element material 13, and thento a liquid drop discharge processing device 405B for B color filterelement material 13, and therein G colored and B colored filter elementmaterial 13 is discharged in order into the predetermined filter elementformation regions 7, in the same manner as was done for making the Rcolored filter portions. And the motherboard 12 upon which these threecolors of filter element material 13 have been discharged, and which hasbeen dried, is recovered and is subjected to heat processing, in otherwords is heated up so that the filter element material 13 is hardenedand is better adhered (in a procedure S6 in FIG. 13).

—Manufacture of the Color Filter—

After this, a protective layer 4 is formed over substantially the entiresurface of the motherboard 12 upon which the filter element 3 has beenformed as described above. Furthermore, an electrode layer 5 made fromITO (Indium Tin Oxide) is formed in an appropriate pattern upon theupper surface of this protective layer 4. After this the motherboard isbroken apart into the individual separate color filter formation regions11, so as to form a plurality of color filters 1 (in a procedure S7 inFIG. 13). As has been explained in connection with previously describedembodiments of the present invention, each of these substrate platesupon which a color filter 1 has been formed is utilized as one of thesubstrate plates for a liquid crystal device.

—Effects of the Device for Manufacture of the Color Filter—

According to this preferred embodiment shown in FIGS. 1 through 13further beneficial operational effects are experienced.

In detail, the ink jet heads 421, upon one surface of which are arrangedthe plurality of nozzles 466 from which the filter element material 13,for example ink, which is a liquid mass which has a certain flowability,is arranged on the one surface of the print substrate plate 435. Thehead device 433 which acts as the discharge means provides the connector441 to be connected with a control means which controls the nozzle 466to suitably discharge the filter element material 13 so as to extrudefrom the peripheral of the ink jet head 421. The head device 433discharges the filter element material 13 to a predetermined portion ofthe motherboard 12 by using the carriage 426 which provides a portion onwhich a part of the connectors 441 of the print substrate plate 435 arealigned so as not to face another portion on which the other of theconnectors 441 are aligned. The carriage 426 moves along the surface ofthe motherboard 12 relative to the motherboard 12 while one surface ofthe ink jet head 421 which comprises the nozzles 466 face to the surfaceof the motherboard with a predetermined distance. Because a plurality ofthe head device 433 which comprises the ink jet heads 421 and theconnectors 441, which are mounted on the carriage 426 by a predeterminedalignment, the discharge device is composed easier comparing withcomposing the plurality of ink jet heads 421 and the connectors 421relative to the ink jet heads 421 without mounting on the carriage, andtherefore it is possible to increase a product efficiency. The headdevices 433 are held by the carriage 426 in a manner that the portionwhere the connectors 441, by which the control device which controls thedischarge of filter element material 13 from the nozzles 466 of the inkjet head 421 are electrically connected, of one group of head device 433is orientated not to face to the ink jet head 421 of the other group ofhead device 433, and the portion where the connectors 442 of one groupare arranged is orientated to an outside which is oppose to the ink jethead 421 of the other group. Therefore, an efficiency of wiring to theconnectors 441 becomes easier and an efficiency of composing increases.Further, in influence of an electrical noise from a portion where theconnectors 441 are located to another portion decreases, and therefore,it is possible to stably discharge the filter element materials 13.

The print substrate plate 435 is formed like a shape of a rectangularcard. The ink jet head 421 is arranged in one longitudinal end portionof the print substrate plate 435 and the connector 441 is arranged inanother longitudinal end portion of the print substrate plate 435. It ispossible to complete a layout in which the connectors 441 in one of thegroups of the head device 433 is orientated so as not to face to the inkjet heads 421 of the other of the groups of the head device 433. Due tothe above layout, it is possible to arrange the ink jet head 421 apartfrom the connector 441, and therefore, the wirings to the connectors 441become to be easier and the efficiency of maintaining of the wiring alsobecomes to be easier.

Further, the ink jet heads 421 are arranged in one end of the printsubstrate plate 435 having a rectangular shape, and the connectors arearranged in the other end of the print substrate plate 435. Therefore,in a case where the head devices 433 are aligned along a single line, aninterference between connectors 441 in one of the head devices 433 andconnectors in the other of the head devices 433 will be prevented andminimize an outline of the head devices 433. A line through whichnecessity numbers of nozzles 466 are aligned is formed, therefore anarea in which any nozzles 466 do not exist is minimized along the mainscanning direction without using an ink jet head having a great numberof nozzles which are aligned in a longitudinal direction.

Because the ink jet heads 421 in one of the groups are orientated pointsymmetrically to the ink jet heads 421 in the other of the groups, it ispossible to simplify the alignment of the supply conduits 478 in avicinity of the head unit 420 so as to easily compose and maintain thedevice.

Because, the connecting wires 442 for controlling the ink jet heads 421are wired from the outer periphery of the head unit 420, namely from theouter periphery of the carriage 426, an influence of the electricalnoise from the connecting wires 442 is omitted so that a fine printingpattern is obtained. The connecting wires 442 can be wired apart fromthe supply conduits 478, therefore it is possible to compose the headunit 420 in ease and damages on the connecting wires 442 and supplyconduits 478 and a fluctuation in the discharge of the filter elementmaterial 13 due to an entanglement of the connecting wires 442 andsupply conduits 478 are prevented.

Because the connectors 441 in one of the groups are aligned by a pointsymmetrical manner so as not to face to the connectors 441 in the otherof the groups, the connectors 441 are protected from an electrical noisenearby the connectors 441 and a fine printing can be performed.

Furthermore, the ink jet heads 421 in which the nozzles 466 whichdischarge filter element material 13 which is a liquid having a certainflowability, for instance a ink, are provided on a single surface upon aplurality of substantially straight lines, and this surface is shiftedrelatively along the surface of the motherboard 12 while maintaining thestate in which a predetermined gap is kept between the surface uponwhich these nozzles 466 of the ink jet heads 421 are arranged and thesurface of the motherboard 12, which is the object against which theliquid drops are to be discharged, and the filter element material 13 isdischarged against the surface of the motherboard 12 from the nozzleswhich are positioned in the central portions of the rows, excluding thepredetermined regions XX, in other words without discharging any filterelement material from, for example, those ten nozzles 466 (the nondischarge nozzles), among all the nozzles 466 of the ink jet heads 421,which are positioned in the predetermined regions XX at both ends of thedirection in which these nozzles 466 are arranged.

Since with this structure the filter element material 13 is dischargedusing the nozzles 466 in the central portion of each row where thedischarge amounts are comparatively uniform, without discharging anyliquid drops from the ten nozzles 466 at each end of each row, which arethe predetermined regions positioned at both ends of the direction inwhich the nozzles 466 are arranged from which the discharge amountswould become particularly great, accordingly it is possible to dischargethe filter element material against the surface of the motherboard 12evenly and uniformly, and a uniform color filter 1 is obtained of aneven quality, so that a desirable display is obtained from the resultingdisplay device which is an electro optical device, using this colorfilter 1.

And, since no filter element material 13 is discharged from thosenozzles 466 for which, if such discharge were to be performed, thedischarge amounts would be more than about 10% greater than the averagevalue of discharge amount of filter material, accordingly, even in theparticular cases of using, as the liquid mass, a functional liquid massof filter element material 13 for a color filter 1, orelectro-luminescent material, or one including electrically chargedgrains for use in an electrical migration device or the like, noundesirable deviations occur in the performance characteristics, and itis possible reliably to obtain the desired characteristic for theelectro optical device such as an electro-luminescent device or a liquidcrystal device.

Furthermore, since the filter element material 13 is discharged from thevarious nozzles 466 in amounts which vary within ±10% of the averagevalue, accordingly the discharge amounts are comparatively uniform, andthe discharge upon the surface of the motherboard 12 is flat anduniform, so that it is possible to obtain an electro optical devicewhose characteristic is a desirable one.

And, by using ink jet heads 421 whose nozzles 466 are arranged upon astraight line at approximately equal intervals, it is possible easily topaint a structure upon the motherboard 12 according to any predeterminedstandard pattern, such as, for example, a stripe type pattern, a mosaictype pattern, a delta type pattern, or the like.

Furthermore since, with this structure of the ink jet heads 421 in whichtheir nozzles 466 are arranged upon a straight line at approximatelyequal intervals, the nozzles 466 are provided at approximately equalintervals along the longitudinal directions of the ink jet heads 421which are formed as elongated rectangles, accordingly it is possible tomake the ink jet heads 421 more compact, and, since interference betweenadjacent portions of each ink jet head 421 and the neighboring ink jethead 421 is prevented, accordingly this size reduction can be performedeasily.

Yet further, since the ink jet heads 421 are relatively shifted in adirection which intersects the direction in which the nozzles 466 arearranged in a state in which the direction of arrangement of the nozzles466 is inclined to the shifting direction, accordingly the pitch betweenthe elements, which is the interval at which the filter element material13 is discharged, comes to be narrower than the pitch between thenozzles 466, so that, only by setting the state of inclination suitably,it is easily possible to make the pitch between the elements which isanticipated when discharging the filter element material 13 against thesurface of the motherboard 12 in a dot pattern correspond to the desiredsuch pitch, and it is no longer necessary to make the ink jet heads 421in correspondence to the pitch between the elements, so that the generalapplicability is enhanced.

And, the plurality of ink jet heads 421 to which the plurality ofnozzles 466 which discharge filter element material 13, for example ink,as a liquid mass which has a certain flowability are provided upon asingle surface are relatively shifted along the surface of themotherboard 12 in a state in which the surface in which these nozzles466 of the ink jet heads 421 are provided is opposed to the surface ofthe motherboard 12, which is the object against which liquid drops areto be discharged, with a predetermined gap being left therebetween, andthe same filter element material 13 is discharged against the surface ofthe motherboard 12 from each of the nozzles 466 of the plurality of inkjet heads 421. Due to this, it becomes possible to discharge the filterelement material 13 over a wide range by using ink jet heads 421 whichhave, for example, the same number of nozzles 466, and which are of thesame specification, so that there is no requirement to use an ink jethead of a special longitudinal dimension, and accordingly it is possibleto avoid using components of a plurality of different specifications, aswas the case with the prior art, so that it is possible to lower theoverall cost.

Furthermore, by for example appropriately setting the number of the inkjet heads 421 which are arranged along the direction in which they areprovided, it becomes possible to make them correspond to the region overwhich the filter element material 13 is to be discharged, andaccordingly it becomes possible to enhance the wideness ofapplicability.

Furthermore, since a plurality of ink jet heads 421 are provided,accordingly, even in the case, for example, that the region upon themotherboard 12 upon which the filter element material 13 is to bedischarged is quite wide, or that it is necessary to discharge thefilter material 13 several times upon the same spot in a superimposedmanner, or the like, it is not necessary to shift the ink jet head 421 aplurality of times, and furthermore it is also not necessary tomanufacture a special ink jet head, so that it is possible to dischargethe filter element material 13 easily with a simple structure.

Even further, by utilizing components of the same format which have thesame number of nozzles for the plurality of ink jet heads 421, bysuitably arranging them, it becomes possible to make them correspond tothe region over which the liquid mass is to be discharged, even thoughonly a single type of ink jet head 421 is used, so that the structure issimplified, the manufacturability is enhanced, and also it is possibleto reduce the cost.

Moreover, since the head unit 420 is made with the plurality of ink jetheads 421 arranged in the carriage 426 in the state in which all therespective arrangement directions of the nozzles 466 are roughlyparallel to one another, accordingly, if for example the directions inwhich the nozzles 466 are arranged are substantially parallel, theregion in which the nozzles 466 are arranged becomes wider, it becomespossible to discharge the filter element material 13 over a wider range,and the discharge efficiency is enhanced; and, further, if they arearranged so as to be parallel along the direction of shifting of the inkjet heads 421, it becomes possible to discharge the filter elementmaterial 13 from the different ink jet heads 421 upon a single spot in asuperimposed manner, and it is possible easily to make the dischargeamounts in the discharge region uniform, so that it is possible toobtain a desirably stabilized painting process.

And, because each of the plurality of ink jet heads 421 is inclined in adirection which intersects the main scanning direction, and moreoverthey are provided as being arranged in rows in a direction which isdifferent from the longitudinal direction of the ink jet heads 421 sothat the direction in which all of the nozzles 466 are arranged aremutually parallel, thereby the pitch between elements, in other wordsthe interval between discharges of the filter element material 13,becomes shorter than the pitch between the nozzles, and, if for examplethe motherboard 12 against which the filter element material 13 is to bedischarged is to be utilized as a display device or the like, it becomespossible to manufacture a finer display. Yet further, it is possible toprevent interference between neighboring ones of the ink jet heads 421,and accordingly a reduction in size can be anticipated. And, moreover,by suitably setting this inclination angle, it is possible suitably toset the pitch in which the dots are painted, so that it is possible toenhance the universality of applicability.

Furthermore, since the plurality of ink jet heads 421 are arranged in aplurality of rows, for example in two rows, which are mutually different(roughly in staggered form), accordingly it is not necessary tomanufacture any special ink jet head having a special or a very longlengthwise dimension, and, even if ink jet heads 421 are used which arepre-existing components, not only do neighboring ink jet heads 421 notinterfere with one another, but regions do not occur between ink jetheads 421 in which no filter element material 13 is discharged, andaccordingly it becomes possible to discharge the filter element materialcontinuously in a suitable manner, in other words to perform continuouspainting.

In detail, the ink jet heads 421, upon one surface of which are arrangedthe plurality of nozzles 466 from which the filter element material 13,for example ink, which is a liquid mass which has a certain flowability,are shifted relatively to the motherboard 12, which constitutes anobject against which liquid drops are to be discharged, so as to followalong its surface, in a state in which the surfaces of the ink jet heads421 in which the nozzles 466 are provided are opposed to the surface ofthe motherboard 12 with a predetermined gap being present between them,and filter element material 13 is discharged from a plurality, forexample from two, of the nozzles 466 which are positioned upon the samestraight line which extends along this relative shifting direction.According to this, a structure is obtained which discharges filterelement material 13 from two different nozzles in a superimposed manner,so that, even if hypothetically undesirable deviations are present inthe discharge amounts between different ones of the plurality of nozzles466, it is possible to average out the discharge amounts of the filterelement material 13 which are discharged, and to prevent undesirabledeviations of the total thereof, so that an even and uniform dischargein a plane to be discharged is obtained, and it is possible to obtain anelectro optical device which has a uniform and desirable characteristicquality in a plane to be displayed.

Yet further, since the dot missing detection unit 487 is provided anddetects the quality of the discharge of the filter element material 13from the nozzles 466, accordingly it is possible to prevent uniformityin the discharge of the filter element material 13, and it becomespossible to discharge the filter element material accurately in adesirable manner, in other words to perform high quality painting.

And, since an optical sensor is provided to the dot missing detectionunit 487, and the passage of the filter element material 13 in adirection which intersects the proper discharge direction for the filterelement material 13 is detected by this optical sensor, accordingly itis possible to detect the state of discharge of the filter elementmaterial 13 accurately with a simple structure, and it becomes possibleto prevent mura in the discharge of the filter element material 13, sothat it becomes possible to discharge the filter element materialaccurately in a desirable manner, in other words to perform high qualitypainting.

Moreover, since the discharge situation is detected by the dot missingdetection unit 487 both before and after the process of discharging thefilter element material 13 from the nozzles 466 against the motherboard12, accordingly it is possible to detect the state of discharge directlybefore and directly after the discharge of the filter element material13 for painting, and thus the state of discharge is accurately detected,and it becomes possible to obtain a desirable quality of painting byaccurately preventing the occurrence of dot missing. It should beunderstood that it would also, as an alternative, be acceptable toperform detection of the state of discharge only at a time point before,or only at a time point after, the actual discharge for painting themotherboard 12.

Furthermore, since the dot missing detection unit 487 is provided on themain scanning direction side of the head unit 420, accordingly itbecomes possible to reduce the shifting distance of the head unit 420due to the detection of the discharge state of the filter elementmaterial 13, and moreover it is possible to keep the shifting along themain scanning direction for discharge just as it is with a simplestructure, and it is possible to detect dot missings at high efficiencywith a simple structure.

—Example of a Device which Utilises a Color Filter—

Next, a color liquid crystal device of the active matrix type will bepresented and explained below, as one example of an electro opticaldevice which is fitted with a color filter according to the abovedescribed preferred embodiment of the present invention. FIG. 50 is afigure showing the sectional structure of a liquid crystal device whichis equipped with a color filter according to this preferred embodiment.

The liquid crystal device 700 of this preferred embodiment of thepresent invention comprises, as its main element, a liquid crystal panel750 which comprises a color filter substrate plate 741 and an activeelement substrate plate 701 which are arranged so as mutually toconfront one another, a liquid crystal layer 702 which is sandwichedbetween these two substrate plates, a phase contrast plate 715 a and apolarization plate 716 a which are attached to the upper surface side(the observer's side) of the color filter substrate plate 741, and aphase contrast plate 715 b and a polarization plate 716 b which areattached to the lower surface side of the active element substrate plate701. The liquid crystal device which is the final product is made byfitting peripheral devices such as driver chips for driving the liquidcrystal material, various connecting wires for transmitting electricalsignals a support member and the like to this liquid crystal panel 750.

The color filter substrate plate 741 is a display side substrate platewhich is provided facing the side of the observer, and which has a lighttransparent substrate plate 742, while the active element substrateplate 701 is a substrate plate which is provided upon its opposite side,in other words upon its rear side.

This color filter substrate plate 741 principally comprises the lighttransparent substrate plate 742 which is made of a plastic film or aglass substrate plate of approximately 300 μm (0.3 mm) or the like, anda color filter 751 which is formed upon the lower side surface (in otherwords, upon the liquid crystal layer side surface) of this substrateplate 742.

The color filter 751 is made as a combination of division walls 706which are formed upon the lower side surface (in other words, upon theliquid crystal layer side surface) of this substrate plate 742, filterelements 703 . . . , and a covering protective layer 704 which coversover the division walls 706 and the filter elements 703 . . . .

The division walls 706 are formed upon the one surface 742 a of thesubstrate plate 742, and are built up in lattice form and are formed soas each to surround a filter element formation region 707, which is aregion for formation of an adhered color layer which defines anindividual filter element 703. These division walls 706 comprise aplurality of holes 706 c . . . . Within each of the holes 706 c, thesurface of the substrate plate 742 is exposed. And the filter elementformation regions 707 . . . are defined as compartments which aredelimited by the inner walls of the division walls 706 (the wallsurfaces of the holes 706 c) and the surface of the substrate plate 742.

The division walls 706 are, for example, made from a black colored lightsensitive resin layer, and, as such a black colored light sensitiveresin layer, it is desirable for them to include, for example, at leastone of a positive type or negative type light sensitive resin such asone which is used in a conventional photo-resist, and an black coloredinorganic material such as carbon block or a black colored organicmaterial. Since these division walls 706 include a black coloredinorganic material or organic material, and are formed at all portionsexcept those where the filter elements 703 are present, thus it ispossible to intercept transmission of light between neighboring ones ofthe filter elements 703, and accordingly these division walls 706 areendowed with the function of serving as light interception layers.

The filter elements 703 are formed by injection according to an ink jetmethod, in other words by discharge, of filter element material of thevarious colors red (R), green (G), and blue (B) into the various filterelement formation regions 707 which are defined across the substrateplate 742 between the inner surfaces of the division walls 706, andafter this by drying out of this filter element material.

Furthermore an electrode layer 705 for liquid crystal drive, which ismade from a transparent electrically conductive material such as ITO orthe like, is formed upon the lower side (the liquid crystal layer side)of the protective layer 704, over substantially the entire surface ofthe protective layer 704. Moreover, an orientation layer 719 a isprovided to cover over this electrode layer 705 for liquid crystal driveupon its liquid crystal layer side, and also an orientation layer 719 bis provided over a picture element electrode 732 upon the side of anopposite side active element substrate plate 701, which will bedescribed hereinafter.

The active element substrate plate 701 is made by forming an insulatinglayer not shown in the figures upon a light transparent substrate plate714, and by further forming, upon this insulating layer, a thin filmtransistor T which functions as a TFT type switching element and apicture element electrode 732. Furthermore, the structure includes aplurality of scan lines and a plurality of signal lines which are made,actually in the form of a matrix, upon the insulating layer which isformed upon the substrate plate 714; and one of the previously describedpicture element electrodes 732 is provided for each of the regions whichare surrounded by these scan lines and signal lines, and a thin filmtransistor T is included at each position which electrically connectstogether each of the picture element electrodes 732 and its scan lineand its signal line, so that, by applying an appropriate signal voltageto the scan line and the signal line, this thin film transistor T can beturned ON or OFF, thus performing control of the supply of electricityto its picture element electrode 732. Furthermore, the electrode layer705 which is formed on the color filter substrate plate 741 upon theopposite side, in this preferred embodiment of the present invention, ismade as a full surface electrode which covers the entire picture elementregion. It should be understood that various other possibilities for theconnecting wire circuit for the TFTs, or for the picture elementelectrode configuration, may also be applied.

The active element substrate plate 701 and the color filter substrateplate (the opposing substrate plate) 741 are adhered together with apredetermined gap being maintained between them by the seal member 755which is formed running around the outer peripheral edge of the colorfilter substrate plate 741. Furthermore, the reference symbol 756denotes a spacer for holding the interval (the cell gap) between thesetwo substrate plates fixed over the surfaces of the substrate plates. Asa result, a rectangular liquid crystal enclosure region is defined as acompartment between the active element substrate plate 701 and the colorfilter substrate plate 741 by the seal member which, as seen in itsplane, is roughly formed as a frame, and liquid crystal material isenclosed within this liquid crystal enclosure region.

As shown in FIG. 50, the color filter substrate plate 741 is smallerthan the active element substrate plate 701, so that, in the adheredstate, the peripheral portion of the active element substrate plate 701projects outwards further than the outer peripheral edge of the colorfilter substrate plate 741. Accordingly, it is possible to form the thinfilm transistors T for picture element switching and at the same timethe TFTs for the drive circuit upon the active element substrate plate701 at the outer peripheral side region of the seal member 455, and thusit becomes possible to provide both a scan lines drive circuit and adata lines drive circuit.

With this liquid crystal panel 750, the above described polarizationplates (polarization sheets) 716 a and 716 b are disposed inpredetermined orientations upon the light incident side and the lightemitting side of the active element substrate plate 701 and of the colorfilter substrate plate 741, according to whether the device will berequired to operate in the normally white mode or in the normally blackmode.

In the liquid crystal panel 750 made according to the above structure,with the active element substrate plate 701, the orientation state ofthe liquid crystal material present between the picture elementelectrode 732 and the opposing electrode 718 is controlled for eachpicture element individually by the display signals which are suppliedto the picture element electrodes 732 via the data lines (not shown inthe figures) and the thin film transistors T, and a predetermineddisplay is performed in correspondence to the display signals. Forexample, if the liquid crystal panel 750 is structured in the TN mode,then, when the rubbing directions when performing rubbing processing forthe orientation layers 719 a and 719 b which are respectively providedbetween the pair of substrate plates (the active element substrate plate701 and the color filter substrate plate 741) are set to mutuallyperpendicular directions, the liquid crystal material is orientated witha twist between the substrate plates, having an angle of 90 degree. Thistype of twist orientation is released by applying an electric field tothe liquid crystal layer 702 between the substrate plates. Thus it ispossible to control the orientation state of the liquid crystal materialfor each region which is formed upon the picture element electrode 732individually (for each picture element individually), according towhether or not an electric field is applied from the outside between thesubstrate plates.

Because of this, if the liquid crystal panel 750 is to be used as atransparent type liquid crystal panel, the light from an illuminationdevice (not shown in the figures) which is disposed at the lower side ofthe active element substrate plate 701, after having been made uniformas light of a predetermined linear polarization by the polarizationplate 716 b upon the incident side, passes through the phase contrastplate 715 b and the active element substrate plate 701 and is incidentupon the liquid crystal material layer 702, and on the one hand in someof the regions thereof this linearly polarized light passes through andis emitted with its polarization axis having been twisted by thistransmission, while on the other hand in other regions this directlypolarized light which passes through is emitted without its polarizationaxis having been twisted at all by this transmission. Due to this, ifthe polarization plate 716 b on the incident side and the polarizationplate 716 a on the emission side are disposed so that their transmissionpolarization axes are mutually perpendicular (the normally white mode),then the light which passes through the polarization plate 716 a whichis disposed upon the emission side of the liquid crystal panel 750 isonly the linearly polarized light whose transmission polarization axishas been thus twisted by transmission through the liquid crystal. Bycontrast, if the polarization plate 716 a on the emission side isdisposed so that its transmission polarization axis is parallel to thetransmission polarization axis of the polarization plate 716 b on theincident side (the normally black mode), then the light which passesthrough the polarization plate 716 a which is disposed upon the emissionside of the liquid crystal panel 750 is only the linearly polarizedlight whose transmission polarization axis has not been twisted bytransmission through the liquid crystal. Accordingly, if the orientationstate of the liquid crystal 702 is controlled for each picture elementindividually, it is possible to display any desired information.

With the liquid crystal panel according to the above structure, becausethe filter elements 703 . . . of the color filter substrate plate 741are made by a method utilizing an ink jet in which a dischargingquantity is controlled in high accuracy, it is possible to perform adisplaying which is uniform in a plane of display.

Although in the above description it was assumed, by way of example,that the color filter was to be applied to a liquid crystal device, thecolor filter according to the present invention can, of course, also beutilized for various applications other than the one described above.For example, this color filter could be applied to a white coloredorganic electro-luminescent device. In other words, a color filtermanufactured as described above may be disposed upon the front surface(the light emitting side) of a white colored organic electro-luminescentdevice. By utilizing such a structure, it is possible to provide anorganic electro-luminescent device which presents a color display, whilebasically utilizing a white colored electro-luminescent device.

It should be understood that the light is controlled in the mannerdescribed below. An organic electro-luminescent device is made so as tobe a source of white colored light, and the amount of light emitted byeach picture element is adjusted by control of transistors which areprovided to each picture element individually, and moreover the desiredcolor display is provided by passing this light through the abovedescribed color filter.

—a Preferred Embodiment Related to a Method of Manufacture Of an ElectroOptical Device which Uses an Electroluminescent Element—

Next, a method of manufacture of an electro optical device according tothe present invention will be explained with reference to the drawings.It should be understood that, as such an electro optical device, anactive matrix type display device which utilizes an electro-luminescentdisplay element will be explained. Moreover, before explaining themethod of manufacture of this display device, the structure of thedisplay device which is to be manufactured will be explained.

—Structure of the Display Device—

FIG. 14 is a circuit diagram showing one portion of an organicelectro-luminescent device made by a device for manufacturing an electrooptical device according to the present invention. And FIG. 15 is amagnified plan view showing the planar structure of one picture elementregion of this display device.

In detail, referring to FIG. 14, the reference symbol 501 denotes adisplay device of the active matrix type which employs anelectro-luminescent display element which is an organicelectro-luminescent device; and this display device 501 comprises, upona transparent display substrate plate 502 which functions as a substrateplate, a plurality of scan lines 503, a plurality of signal lines 504which extend in a direction which is transverse to these scan lines 503,a plurality of common power supply lines 505 which extend parallel tothese signal lines 504, and connecting wires for all these. And apicture element region 501A is provided at each of the points ofintersection of the scan lines 503 and the signal lines 504.

A data side drive circuit 507 is provided for the signal lines 504, andcomprises a shift register, a level shifter, a video line, and an analogswitch. Furthermore, a scan side drive circuit 508 is provided for thescan lines 503, and comprises a shift register and a level shifter. Andeach of the picture element regions 501A is provided with a switchingthin film transistor 509 which is supplied with a scan signal at itsgate electrode via a scan line 503, a capacitor cap which accumulatesand holds a picture signal which is supplied from a signal line 504 viathis switching thin film transistor 509, a current thin film transistor510 which is supplied at its gate electrode with the picture signalwhich has been held by this capacitor cap, a picture element electrode511 into which drive electrical current flows from a common power supplyline 505 when it is electrically connected to the common power supplyline 505 via this current thin film transistor 510, and a light emittingelement 513 which is sandwiched between this picture element electrode511 and a reflecting electrode 512.

According to this structure, when the switching thin film transistor 509which is driven by the scan line 503 is ON, the voltage at this timeupon the signal line 504 is held in the capacitor cap. The ON or OFFstate of the current thin film transistor 510 is determined according tothe state of this capacitor cap. And electrical current flows to thepicture element electrode 511 from the common power supply line 505 viathe channel of the current thin film transistor 510, and furthermoreelectrical current flows through the light emitting element 513 to thereflecting electrode 512. By doing this, the light emitting element 513emits light according to the magnitude of this flow of current.

As shown in FIG. 15 which is a magnified plan view showing the pictureelement region 501A in a state in which the reflecting electrode 512 andthe light emitting element 513 have been removed, the four sides of therectangular picture element electrode 511, as seen in a planar state,are arranged so as to be surrounded by the signal line 504, the commonpower supply line 505, the scan line 503, and the scan line 503 foranother neighboring picture element electrode 511 not shown in thefigure

—Process of Manufacture of the Display Device—

Next, various procedures of a manufacturing process for manufacture of adisplay device of the active matrix type using the above describedelectro-luminescent display element will be explained. FIGS. 16 through18 are manufacturing process sectional views showing various proceduresof a manufacturing process for manufacture of a display device of theactive matrix type using the above described electro-luminescent displayelement. It should be understood that, as a liquid drop discharge deviceand a scanning method for forming an electro-luminescent layer by thedischarge of liquid drops, the same ones may be employed as have alreadybeen explained above with reference to other preferred embodiments ofthe present invention.

—Preliminary Processing—

First, as shown in FIG. 16(A), according to requirements, a protectivebacking layer not shown in the drawings, which consists of a siliconoxide film of thickness dimension about 2000 to 5000 angstroms, isformed upon the transparent display substrate plate 502 by a plasma CVD(Chemical Vapor Deposition) process, using tetraethoxysilane (TEOS) oroxygen gas or the like as source gas. Next, the temperature of thedisplay substrate plate 502 is set to about 350 degree Celsius, and asemiconductor film layer 502 a, which is an amorphous silicon layer ofthickness dimension about 300 to 700 angstroms, is formed upon thesurface of the protective backing layer by a plasma CVD method. Afterthis, a crystallization process of laser annealing or a solid growthmethod or the like is performed upon the semiconductor film 520 a, sothat the semiconductor film 520 a is crystallized into a poly-siliconlayer. Here by laser annealing is meant a process of utilizing, forexample, an line beam from an excimer laser of wavelength about 400 nmat an output intensity of about 200 mJ/cm². With regard to this linebeam, the line beam is scanned along its shorter direction so that, foreach region, the portions which correspond to about 90% of the peakvalue of the laser intensity are superimposed.

And, as shown in FIG. 16(B), the semiconductor film 520 a is formed bypatterning into a blob shaped semiconductor film 520 b. A gateinsulating layer 521 a which is a silicon oxide film or a nitrate layerof thickness dimension of about 600 to 1500 angstroms is formed upon thedisplay substrate plate 502 which is provided with this semiconductorfilm 520 b by a plasma CVD method, using TEOS or oxygen gas or the likeas source gas. It should be understood that, although this semiconductorfilm 520 b is the one which will constitute the channel region and thesource and drain regions for the current thin film transistor 510, inanother sectional position there is also formed a semiconductor film notshown in the figures which will constitute the channel region and thesource and drain regions for the switching thin film transistor 509. Inother words, although the switching thin film transistor 509 and thecurrent thin film transistor 510 which are of two types are formed atthe same time in the manufacturing process shown in FIGS. 16 through 18,nevertheless, in the following explanation, only the formation of thecurrent thin film transistor 510 will be explained, while theexplanation of the switching thin film transistor 509 will be curtailed,since it is formed by the same procedure.

After this, as shown in FIG. 16(C), and after a conductive film, whichis a metallic film made from aluminum, tantalum, molybdenum, titanium,tungsten or the like, has been formed by a spattering method, the gateelectrode 510A shown in FIG. 15 is formed by patterning. In this statethe work-piece is bombarded by phosphorus ions, so as to form upon thesemiconductor film 520 b the source and drain regions 510 a and 510 bwhich mutually match with the gate electrode 510A. It should beunderstood that the portion into which the impurities have not beenintroduced constitutes the channel region 510 c.

Next, as shown in FIG. 16(D), after an inter layer insulating layer 522has been formed, contact holes 523 and 524 are formed therein, andjunction electrodes 526 and 527 are embedded in these contact holes 523and 524.

Furthermore, as shown in FIG. 16(E), a signal line 504, a common powersupply line 505, and a scan line 503 (not shown in FIG. 16) are formedabove the inter layer insulating layer 522.

At this time, the various lead wires for the signal line 504, the commonpower supply line 505, and the scan line 503 are formed of sufficientthickness, without being prejudiced by the necessary thickness dimensionfor lead wires. In concrete terms, it will be acceptable to form each ofthese lead wires, for example, with a thickness dimension ofapproximately 1 to 2 μm. Here, it will be acceptable to form thejunction electrode 527 and the various lead wires by the same process.At this time, a junction electrode 526 is formed from an ITO layer whichwill be described hereinafter.

And an inter layer insulating layer 530 is formed to cover the uppersurfaces of the various lead wires, and a contact hole 532 is formed ina position which corresponds to the junction electrode 526. An ITO layeris formed so as to fill in this contact hole 532, and this ITO layer ispatterned, so as to form the picture element electrode 511 which iselectrically connected to the source and drain region 510 a in apredetermined position which is surrounded by the signal line 504, thecommon power supply line 505, and the scan line 503.

Here, in FIG. 16(E), the portion which is sandwiched between the signalline 504 and the common power supply line 505 is the one whichcorresponds to a predetermined position into which optical material isselectively to be provided. And steps 535 are formed by the signal line504 and the common power supply line 505 between this predeterminedposition and its surroundings. In concrete terms, this predeterminedposition is lower than its surroundings, and is defined as a concaveportion by the steps 535.

—Discharge of the Electro-Luminescent Material—

Next an electro-luminescent material, which is a functional liquid mass,is discharged by an ink jet method against the display substrate plate502 upon which the above described preliminary processing has beenperformed. In other words, as shown in FIG. 17(A), in a state in whichthe upper surface of the display substrate plate 502 upon which theabove described preliminary processing has been performed is facingupwards, an optical material mass 540A, which is a precursor in the formof a solution, dissolved in a solvent, and which serves as a functionalliquid mass for forming a positive hole injection layer 513A whichtouches the lower layer portion of the light emitting element 140, isdischarged by an ink jet method, in other words by using a deviceaccording to one of the preferred embodiments of the present inventiondescribed above, and thus is selectively applied to certain ones of theregions surrounded by the steps 535 which are located in certainpredetermined positions.

As the optical material 540A which is to be discharged for forming thispositive hole injection layer 513A, poliphenylenevinylene which polymerprecursor is polytetrahydrothiophenylphenylen,1,1-bis-(4-N,N-ditlylaminophenyl) cyclohexane,tris(8-hydroxyquinolinole) Aluminum or the like may be used.

It should be understood that, since during this discharge process theoptical material 540A, which is a liquid mass which has a certainflowability, has a high flowability just as in the case of dischargingthe filter element material 13 against the division walls which wasdescribed above with reference to various other preferred embodiments,accordingly, even though this optical material 540A may attempt tospread out in the sideways direction, since the steps 535 are formed soas to surround the positions where this optical material 540A has beenapplied, it is possible to prevent the optical material 540A gettingover the steps 535 and spreading to the outside of the predeterminedpositions where it is supposed to be applied, provided that the amountof discharge of the optical material 540A in one discharge episode isnot extremely increased.

And, as shown in FIG. 17(B), the liquid in the optical material 540A isvaporized by being heated up or by being illuminated or the like, so asto form a thin solid positive hole injection layer upon the pictureelement electrode 511. The processes of FIGS. 17(A) and (B) are repeatedfor the necessary number of times, until, as shown in FIG. 17(C), apositive hole injection layer 513A of sufficient extent in the thicknessdimension has been formed.

Next, as shown in FIG. 18(A), in the state in which the upper surface ofthe display substrate plate 502 is facing upwards, an optical materialmass 540B, which is an organic fluorescent material in the form of asolution, dissolved in a solvent, and which serves as a functionalliquid mass for forming an organic semiconductor film 513B as a layerabove the light emitting element 513, is discharged by an ink jetmethod, in other words by using a device according to one of thepreferred embodiments of the present invention described above, and thusis selectively applied to certain ones of the regions surrounded by thesteps 535 which are located in certain predetermined positions. Itshould be understood that this optical material 540B is prevented fromoverflowing over the steps 535 and spreading to the outside of thepredetermined positions in the same way as in the case of the dischargeof the optical material 540A, as has been described above.

As the optical material 540B which is to be discharged for forming thisorganic semiconductor film 513B, cyanopolypheniyphenilenevinylene,polyphenylvinylene, polyalkylphenilene,2,3,6,7-tetrahydro-11-oxo-1H.5H.11H(1)benzopyrano[6,7,8-ij]-quinolysine-10-carboxylicacid,1,1-bis(4-N,N-ditolylaminophenyl)cyclohexane,2-13,4°-dihydroxyphenil-3,5,7-trihydroxy-1-benzopyryliumperchlorate,tris(8-hydroxyquinoquinol) aluminum,2,3,6,7-tetrahydro-9-methyl-11-oxo-1H.5H.11H(1)benzopyrano[6,7,8-ij]-quinolisine,aromaticdiaminederivative(TDP), oxydiazoledimer(OXD),oxydiazolederivetive(PBD), distilarylenederivative(DSA),quinolinol-metallic-complex, beryllium-benzoquinolinolcomplex(Bebq),triphenylaminederivetive(MTDATA), distyllylderivative, pyrazolinedimer,rublene, quinacridone, triazolederivetive, polyphenylene,polyalkylfluorene, polyalkylthiophene, azomethynezinccomplex,polyphyrinzinccomplex, benzooxazolezinccomplex,phenanthrolineeuropiumcomplex or the like may be used.

Next, as shown in FIG. 18(B), the solvent in the optical material 540Bis vaporized by being heated up or by being illuminated or the like, soas to form a thin organic semiconductor film 513B above the positivehole injection layer 513A. The processes of FIGS. 18(A) and (B) arerepeated for the necessary number of times, until, as shown in FIG.18(C), an organic semiconductor film 513B of sufficient extent in thethickness dimension has been formed. The positive hole injection layer513A and the organic semiconductor film 513B together constitute a lightemitting element 513. Finally, as shown in FIG. 18(D), a reflectingelectrode 512 is formed upon the entire surface of the display substrateplate 502, or in stripe form, and thereby the display device 501 ismanufactured.

With this preferred embodiment shown in FIGS. 14 through 18 as well, itis possible to reap the same operational benefits as in the otherpreferred embodiments described earlier, by performing an ink jet methodin the same manner. Furthermore, when selectively applying thefunctional liquid masses, it is possible to prevent them flowing outfrom the regions where they are supposed to be deposited, so that it ispossible to perform patterning at high accuracy.

It should be understood that although the color display according tothis preferred embodiment shown in FIGS. 14 through 18 has beenexplained in terms of its principal application to an active matrix typedisplay device which uses an electro-luminescent display element, thestructure shown in FIGS. 14 through 18 could also, for example, beapplied to a display device which incorporates a monochrome display.

In detail, it would also be acceptable to form the organic semiconductorfilm 513B uniformly over the entire surface of the display substrateplate 502. However even in this case it is extremely effective to takeadvantage of the steps 111, since it is necessary to provide thepositive hole injection layer 513A selectively in each of thepredetermined positions in order to prevent cross-talk. It should beunderstood that, in this FIG. 19, to structural elements which are thesame as in the previous preferred embodiment shown in FIGS. 14 through18, the same reference symbols are affixed.

Furthermore, this type of display device which uses anelectro-luminescent display element is not limited to the active matrixtype; for example, it could also be a display device of the passivematrix type shown in FIG. 20. FIG. 20 shows an electro-luminescentdevice made by a device for manufacture of an electro optical deviceaccording to the present invention, and its FIG. 20(A) is a plan viewshowing the arrangement relationship of a plurality of first bus leadwires 550 and a plurality of second bus lead wires 560 which arearranged in the direction perpendicular to these first bus lead wires550, while its FIG. 20(B) is a sectional view thereof taken in a planeshown by the arrows B-B in FIG. 20(A). In this FIG. 20, to structuralelements which are the same as in the previous preferred embodimentshown in FIGS. 14 through 18, the same reference symbols are affixed,and the description thereof will herein be curtailed in the interests ofbrevity of description. Furthermore, since the details of themanufacturing process for this embodiment are the same, mutates mutandi,as those for the previous preferred embodiment shown in FIGS. 14 through18, figures and description thereof will herein be curtailed.

This preferred embodiment display device shown in FIG. 20 is one inwhich an insulating layer 570 made of, for example, SiO₂ is provided soas to surround the predetermined positions in which the light emittingelements 513 are provided, and by doing this steps 535 are formedbetween these predetermined positions and their surroundings. Due tothis, when selectively applying the functional liquid mass, it ispossible to prevent it from flowing out of the areas where it issupposed to be deposited, and accordingly it is possible to performpatterning at high accuracy.

Furthermore, even in the case of an active matrix type display device,the present invention is not limited to the structure of the preferredembodiment shown in FIGS. 14 through 18. In other words, it would bepossible to utilize a device of the structure shown in FIG. 21, of thestructure shown in FIG. 22, of the structure shown in FIG. 23, of thestructure shown in FIG. 24, of the structure shown in FIG. 25, of thestructure shown in FIG. 26, or the like.

By forming the steps 535 by taking advantage of the picture elementelectrode 511, the display device shown in FIG. 21 is made so as to becapable of high accuracy patterning. FIG. 21 is a sectional view showingan intermediate stage in the manufacturing process for this displaydevice, and, since the stages before and after this stage aresubstantially the same as in the case of the preferred embodiment shownin FIGS. 14 through 18, description thereof and figures illustrating thesame will herein be curtailed.

With this display device shown in FIG. 21, the picture element electrode511 is formed to be thicker than normal, and thereby the steps 535 areformed between it and its surroundings. In other words, with thisdisplay device shown in FIG. 21, the convex type steps are formed sothat the picture element electrode 511, to which the optical materialwill be applied afterwards, becomes higher than its surroundings. Andthe optical material 540A, which is a precursor for forming the positivehole injection layer 513A, which touches the lower layer portion of thelight emitting element 513, is discharged by an ink jet method in thesame manner as in the case of the preferred embodiment described abovewith reference to FIGS. 14 through 18, and is thereby applied to theupper surface of the picture element electrode 511.

However, the difference from the case of the preferred embodimentdescribed above and shown in FIGS. 14 through 18 is that the opticalmaterial 540A is discharged and is applied in a state in which thedisplay substrate plate 502 is reversed in the vertical direction, inother words in a state in which the upper surface of the picture elementelectrode 511 to which the optical material 540A is applied is facingdownwards. Because of this configuration, due to gravity and surfacetension, the optical material 540A accumulates upon the upper surface ofthe picture element electrode 511 (its lower surface as seen in FIG.21), and does not spread to the surroundings thereof. Accordingly, if itis solidified by being heated up or by being exposed to light or thelike, it is possible to form a thin positive hole injection layer 513Ain the same manner as in FIG. 17(B), and, if this is repeated, thepositive hole injection layer 513A is formed. The organic semiconductorfilm 513B is formed by the same procedure. Due to this feature, it ispossible to perform patterning at high accuracy while taking advantageof the convex form steps. It should be understood that this concept isnot limited to the exploitation of gravity and surface tension; it wouldalso be acceptable to adjust the amount of the optical materials 540Aand 540B by taking advantage of inertial force such as centrifugalforce.

The display device shown in FIG. 22 is also a display device of theactive matrix type. FIG. 22 is a sectional view showing an intermediatestage in the manufacturing process for this display device, and, sincethe stages before and after this stage are substantially the same as inthe case of the preferred embodiment shown in FIGS. 14 through 18,description thereof and figures illustrating the same will herein becurtailed.

With this display device shown in FIG. 22, first, a reflecting electrode512 is formed upon the display substrate plate 502, and then afterwardan insulating layer 570 is formed upon this reflecting electrode 512 soas to surround the predetermined positions in which the light emittingelements 513 are to be provided, and, by doing this, concave type steps535 are formed so that these predetermined positions become lower thantheir surroundings.

And, in the same manner as in the case of the preferred embodiment shownin FIGS. 14 through 18, the optical materials 540A and 540B areselectively discharged and applied to the regions surrounded by thesteps 535 by an ink jet method as functional liquid masses, and therebythe light emitting elements 513 are formed.

On the other hand, a scan line 503, a signal line 504, a picture elementelectrode 511, a switching thin film transistor 509, a current thin filmtransistor 510, and an inter layer insulating layer 530 are formed upona stripping layer 581 which is laid upon a substrate plate for stripping580. Finally, the structure which has been stripped from the strippinglayer 581 upon the substrate plate for stripping 580 is transferred tothe surface of the display substrate plate 502.

With this preferred embodiment of FIG. 22 reduction of the damage due toapplication of the optical material 540A, 540B to the scan line 503, thesignal line 504, the picture element electrode 511, the switching thinfilm transistor 509, the current thin film transistor 510, and the interlayer insulating layer 530 can be anticipated. It should be understoodthat this concept can also be applied to a passive matrix type displayelement.

The display device shown in FIG. 23 is a display device of the activematrix type. FIG. 23 is a sectional view showing a stage partway throughthe manufacturing process for manufacture of this display device, and,since the stages before and after this stage are substantially the sameas in the case of the preferred embodiment shown in FIGS. 14 through 18,description thereof and figures illustrating the same will herein becurtailed.

This display device shown in FIG. 23 is one in which the concave formedsteps 535 are made by taking advantage of the inter layer insulatinglayer 530. Due to this, there is no requirement to add any furtherspecial process, and it is possible to take advantage of the inter layerinsulating layer 530, so that it is possible to prevent great furthercomplication of the process of manufacture. It should be understoodthat, along with forming the inter layer insulating layer 530 from SiO₂,it would also be acceptable to irradiate its surface with ultravioletlight or with a plasma such as O₂, CF₃, Ar or the like, and thereafterto expose the surface of the picture element electrode 511, andselectively to apply the optical material liquid 540A, 540B bydischarging it. By doing this a strong distribution of liquid repulsionis formed along the surface of the inter layer insulating layer 530, andit becomes easy to accumulate the optical material liquid 540A, 540B inthe predetermined positions by the liquid repulsion operation both ofthe surface level differential portion 535 and also of the inter layerinsulating layer 530.

With the display device shown in FIG. 24, it is arranged to prevent theoptical material 540A, 540B which is applied from spreading to itssurroundings, by making the hydrophilic characteristic of thepredetermined positions to which this optical material 540A, 540B, whichis a liquid mass, is applied to be relatively stronger than thehydrophilic characteristic of their surroundings. FIG. 24 is a sectionalview showing an intermediate stage in the manufacturing process for thisdisplay device, and, since the stages before and after this stage aresubstantially the same as in the case of the preferred embodiment shownin FIGS. 14 through 18, description thereof and figures illustrating thesame will herein be curtailed.

With this display device shown in FIG. 24, after forming the inter layerinsulating layer 530, an amorphous silicon layer 590 is formed upon itsupper surface. Since the hydrophobic characteristic of this amorphoussilicon layer 590 is stronger than that of the ITO from which thepicture element electrode 511 is made, accordingly, here, a distinctlydefined distribution of hydrophobic characteristics and hydrophiliccharacteristics is created, with the hydrophilic characteristic of thesurface of the picture element electrode 511 being relatively strongerthan the hydrophilic characteristic of its surroundings. And then, inthe same manner as in the case of the preferred embodiment shown inFIGS. 14 through 18, the light emitting element 513 is formed byselectively discharging the optical material liquid 540A, 540B by an inkjet method and applying it against the upper surface of the pictureelement electrode 511; and finally the reflecting electrode 512 is made.

Moreover, it is also possible to apply this preferred embodiment shownin FIG. 24 to a display element of the passive matrix type. Furthermore,as in the preferred embodiment shown in FIG. 22, it would also beacceptable to include a process of transferring a structure which hasbeen formed with a stripping layer 581 upon a substrate plate forstripping 580 to the display substrate plate 502.

And, with regard to the hydrophilic and hydrophobic distribution, itwould also be acceptable to form the insulating layer of metal, anodizedoxide film, or polyimide or silicon oxide or the like from somedifferent material. It should also be understood that in the case of adisplay element of the passive matrix type it would be acceptable toform it from the first bus connecting wires 550, while in the case of adisplay element of the active matrix type, it would be acceptable toform it from the scan line 503, the signal line 504, the picture elementelectrode 511, the insulating layer 530, or the light interception layer6 b.

The display device shown in FIG. 25 is one in which it is contemplated,not to enhance the accuracy of the patterning by taking advantage of thesteps 535 or the distribution of hydrophobic and hydrophiliccharacteristics or the like, but, rather, to enhance the accuracy of thepatterning by taking advantage of attraction and repulsion and the likedue to electrical potential. FIG. 25 is a sectional view showing a stagepartway through the manufacturing process for manufacture of thisdisplay device, and, since the stages before and after this stage aresubstantially the same as in the case of the preferred embodiment shownin FIGS. 14 through 18, description thereof and figures illustrating thesame will herein be curtailed.

With this display device shown in FIG. 25, along with driving the signalline 504 and the common power supply line 505, an electrical potentialdistribution is formed by suitably turning ON and OFF a transistor notshown in the figures, so as to bring the picture element electrode 511to a minus electrical potential, and so as to bring the inter layerinsulating layer 530 to a plus electrical potential. And the opticalmaterial liquid 540A, 540B which is charged to a positive electricalpotential is selectively discharged by an ink jet method, so as to beapplied in the predetermined position. By doing this, since the opticalmaterial 540A, 540B is charged up, it is also possible to take advantageof static electrical charging rather than spontaneous electricalpolarization, and accordingly it is possible to enhance the accuracy bywhich the patterning is performed.

It should be understood that this preferred embodiment shown in FIG. 25can also be applied to a passive matrix type display element.Furthermore, just like the preferred embodiment shown in FIG. 22, itwould also be acceptable to include a process of transferring astructure formed via a stripping layer 581 upon a substrate plate forstripping 580 to the display substrate plate 502

Furthermore, although voltage is supplied to both the picture elementelectrode 511 and the inter layer insulating layer 530 which surroundsit, the present invention is not to be considered as being limited bythis feature; for example, as shown in FIG. 49, it would also beacceptable, without supplying any voltage to the picture elementelectrode 511, to supply a positive voltage only to the inter layerinsulating layer 530, and to thus bring the optical material liquid 540Ato a positive electrical potential by induction. Since, according tothis structure shown in FIG. 49, the optical material liquid 540A canreliably be maintained in this state at a positive induced potentialeven after application, accordingly it is possible more reliably toprevent the optical material liquid 540A flowing out to the surroundingportions, due to the repulsive force between it and the surroundinginter layer insulating layer 530.

—Another Preferred Embodiment Related to a Method of Manufacture of anElectro Optical Device which Uses an Electroluminescent Element—

Next, another preferred embodiment of the method of manufacture of anelectro optical device according to the present invention will beexplained with reference to the drawings. In the following, the factthat this invention is applied to an electro optical device which is adisplay device of the active matrix type and which employs anelectro-luminescent display element is the same as in the case of theabove described preferred embodiment, and also its circuit structure isthe same as that of the previous preferred embodiment described aboveand shown in FIG. 14.

—Structure of the Display Device—

FIG. 30(a) is a schematic plan view of the display device of thispreferred embodiment, while FIG. 30(b) is a schematic sectional viewtaken in a plane shown by the arrows A-B in FIG. 30(a). As shown inthese figures, the display device 31 according to this preferredembodiment of the present invention comprises a transparent base plate32 which is made from glass or the like, a set of light emittingelements which are arranged in the form of a matrix, and a sealingsubstrate plate. The light emitting elements which are formed upon thebase plate 32 are constituted by a picture element electrode, afunctional layer, and a negative electrode 42.

The base plate 32 is a transparent substrate plate made of, for example,glass or the like, and is compartmented into a display region 32 a whichis positioned centrally upon the base plate 32, and a non display region32 b which is positioned around the peripheral edge of the base plate32, disposed on the outside of the display region 32 a.

The display region 32 a is a region which is made up from light emittingelements which are arranged in the form of a matrix, i.e. is a so calledavailable for display region. Furthermore, the non display region 32 bis formed on the outside of the display region 32 a. And a dummy displayregion 32 d is formed in this non display region 32 b, adjacent to thedisplay region 32 a.

Furthermore, as shown in FIG. 30(b), a circuit element portion 44 isprovided between light emitting element portions 41, which are made upfrom light emitting elements and bank portions, and the base plate 32;and the previously mentioned scan lines, signal lines, hold capacity,switching thin film transistors, and thin film transistors 123 for driveand the like are provided to this circuit element portion 44.

Furthermore, one end of the negative electrode 42 is connected to anegative electrode connecting wire 42 a which is formed upon the baseplate 32, and the one tip portion of this connecting wire 42 a isconnected to a connecting wire 35 a upon a flexible substrate plate 35.Furthermore, the connecting wire 35 a is connected to a drive IC (drivecircuit) 36 which is provided upon the flexible substrate plate 35.

Yet further, as shown in FIG. 30(a) and FIG. 30(b), electrical powersupply lines 103 (103R, 103G, and 103B) are connected to the non displayregion 32 b of the circuit element portion 44.

Furthermore, the previously mentioned scanning side drive circuits 105,105 are provided at both sides as seen in FIG. 30(a) of the displayregion 32 a. These scanning side drive circuits 105, 105 are providedwithin the circuit element portion 844 of the lower side of the dummyregion 32 d. Moreover, drive circuit control signal lead wires 105 awhich are connected to the scanning side drive circuits 105, 105 anddrive circuit electric power source lead wires 105 b are provided withinthe circuit element portion 44.

And furthermore, a checking circuit 106 is provided at the upper side ofthe display region 32 a as seen in FIG. 30(a). By the use of thischecking circuit 106, it is possible to perform checking of the qualityof the display device during manufacture and before shipping, and todetect any defects in it.

Furthermore, as shown in FIG. 30(b), a sealing portion 33 is providedover the light emitting element portions 41. This sealing portion 33 ismade up from a sealing resin 603 a which is applied upon the base plate32, and a covering and sealing substrate plate 604. The sealing resin603 may consist of a heat curing resin or an ultraviolet light curingresin or the like, and in particular, it is desirable for it to be anepoxy resin, which is one type of heat curing resin.

This sealing resin 603 is applied in the form of a ring around theperiphery of the base plate 32; for example, it may be applied by usinga micro dispenser or the like (not shown in the figures). Since thissealing resin 603 bonds the base plate 32 and the covering and sealingcover plate 604 together, the entry of water or oxygen into the internalportion under the covering and sealing substrate plate 604, between itand the base plate 32, is positively prohibited, and accordinglyoxidization of the negative electrode 42 or of a light emission layer,not shown in the figures, which is formed in the light emitting elementportions 41 is prevented.

Since the covering and sealing substrate plate 604 is made from glass ora metallic material, and it is adhered to the base plate 32 with thesealing resin 603, accordingly a concave portion 604 a is defined, inthe inside of which the display element 40 is received. Furthermore, agetter element 605 which absorbs water or oxygen or the like is providedwithin this concave portion 604 a, and accordingly it becomes possibleto absorb any water or oxygen or the like which has penetrated to theinternal portion of the device, below the sealing substrate plate 604.It should be understood that this getter material may be omitted,without departing from the scope of the present invention.

Next, a magnified view of the sectional structure of the display regionof this display device is shown in FIG. 31. This figure includes threeof the picture element regions A. This display device 31 comprises acircuit element portion 44 which is made of a circuit such as TFT or thelike, and a light emitting portion 41 within which a functional layer110 is formed, superimposed in order as layers upon the base plate 32.

With this display device 31, light which has been emitted from thefunctional layer 110 towards the side of the base plate 32 passesthrough the circuit element portion 44 and the base plate 32 and isemitted on the lower side of the base plate 32 (the observer side), andalso the light which has been emitted from the functional layer 110towards the side which is opposite to the base plate 32 is reflected bythe negative electrode 42, and then passes through the circuit elementportion 44 and the base plate 32, thus also coming to be emitted on thelower side of the base plate 32 (the observer side).

It should be understood that it would be possible for light to beemitted from the negative electrode side of the display device by usinga transparent material for the negative electrode 42. It would bepossible to use, as this transparent material, ITO, Pt, Ir, Ni, or Pd.It is desirable to make the film thickness be about 75 nm; or,alternatively, it may be desirable to make the film thickness eventhinner.

In the circuit element portion 44, upon the base plate 32, there isformed a protective backing layer 32 c which is made from silicon oxidefilm, and islands (blobs) of semiconductor film 141 which are made frompolycrystalline silicon are formed upon this protective backing layer 32c. It should be understood that source regions 141 a and drain regions141 b are formed in the semiconductor films 141 by high concentration Pion bombardment. Furthermore, a portion into which P has not beeninjected constitutes a channel region.

Furthermore, a transparent gate insulating layer 142 which covers overthe protective backing layer 32 c and the semiconductor films 141 isformed in the circuit element portion 44, gate electrodes 143 (the scanlines 101) made from Al, Mo, Ta, Ti, W or the like are formed over thisgate insulating layer 142, and a transparent first inter layerinsulating layer 144 a and a transparent second inter layer insulatinglayer 144 b are formed over the gate electrodes 143 and the gateinsulating layer 142. The gate electrodes 143 are provided in positionswhich correspond to the channel regions 141 c of the semiconductor films141.

Furthermore, contact holes 145 and 146 for respectively connecting tothe source and the drain regions 141 a and 141 b of the semiconductorfilms 141 re pierced through the first and the second inter layerinsulating layers 144 a and 144 b.

And transparent picture element electrodes 111 which are made from ITOor the like are formed upon the second inter layer insulating layer 144b by patterning in a predetermined pattern, and the one set of contactholes 145 are connected to these picture element electrodes 111.

Furthermore, the other set of contact holes 146 are connected to theelectric power source leads 103.

By this construction, in the circuit element portion 44, a thin filmtransistor 123 is connected to each of the picture element electrodes111 for driving it.

It should be understood that, although thin film transistors 112 for theabove described hold capacity and switching are also formed in thecircuit element portion 44, they are not shown in FIG. 31, and theirdescription will herein be curtailed.

Next, as shown in FIG. 31, the light emitting element portions 41principally comprise functional layers 110 which are superimposed aslayers over each of the plurality of picture element electrodes 111 . .. , bank portions 112 which are provided between each of the pictureelement electrodes 111 and the functional layers 110 and whichcompartment up the various functional layers 110, and the negativeelectrode 42 which is formed over these functional layers 110. Thesepicture element electrodes (first electrodes) 111, functional layers110, and the negative electrode 42 (the opposing electrode) togetherconstitute the light emitting element.

Here, the picture element 111 is formed in a substantially rectangularpattern as seen in plan view by, for example, being formed from ITO. Itis desirable for the thickness of this picture element region 111 to befrom 50 to 200 nm, and more particularly it may be about 150 nm. Thebank portions 112 are provided between each of these picture elementelectrodes 111 . . . .

The bank portions 112, as shown in FIG. 31, are each made by thesuperposition of an inorganic material bank layer 112 a (the first banklayer) which is positioned on the side towards the base plate 32, and anorganic material bank layer 112 b (the second bank layer) which ispositioned further from the base plate 32.

The inorganic material bank layers 112 a and the organic material banklayers 112 b are formed so as to ride up over the edge portions of thepicture element electrodes 111. As seen in plan view, the structure issuch that the surroundings of the picture element electrodes 111 and theinorganic material bank layers 112 a are arranged so as to besuperimposed upon one another. Furthermore, in the same manner, theorganic material bank layers 112 b are also, in plan view, superimposedover the one portions of the picture element electrodes 111.Furthermore, the inorganic material bank layers 112 a are formed so thatedge portions 112 e thereof extend more towards the centers of thepicture element electrodes 111 than do the organic material bank layers112 b. According to this construction, by these edge portions 112 e ofthe inorganic material bank layers 112 a being formed so as to extendmore towards the centers of the picture element electrodes 111, loweropening portions 112 c are formed which correspond to the positionswhere the picture element electrodes 111 are formed.

Furthermore, upper opening portions 112 d are formed in the organicmaterial bank layers 112 b. These upper opening portions 112 d areprovided so as to correspond to the positions in which the pictureelement electrodes 111 are formed, and to the lower opening portions 112c. The upper opening portions 112 d, as shown in FIG. 31, are made to bewider than the lower opening portions 112 c and narrower than thepicture element electrodes 111. Furthermore, it may be the case that thepositions of the tops of the upper openings 112 d and of the tipportions of the picture element electrodes 111 are made to be almost inthe same position. In this case, as shown in FIG. 31, the sections ofthe upper openings 112 d of the organic material bank layer 112 b areformed so as to be inclined.

And, by connecting together the lower opening portions 112 c and theupper opening portions 112 d in the bank portions 112, opening portions112 g are defined which are pierced through the inorganic material banklayers 112 a and the organic material bank layers 112 b.

Furthermore, it is desirable to make the inorganic material bank layers112 a from an inorganic material such as, for example, SiO₂, TiO₂, orthe like. The film thickness of this inorganic material bank layer 112 ais desirably in the range from 50 to 200 nm, and in particular may be150 nm. If the film thickness is less than 50 nm, the inorganic materialbank layers 112 a becomes thinner than a positive holeinjection/transport layer which will be described hereinafter, which isnot desirable, since it becomes impossible to ensure the flatness of thepositive hole injection/transport layer. On the other hand, if the filmthickness is greater than 200 nm, then the steps due to the loweropening portions 112 c become large, and this is not desirable, becauseit becomes impossible to ensure the flatness of a light emission layerwhich will be described hereinafter which is superimposed over thepositive hole injection/transport layer.

Furthermore, the organic material bank layers 112 b are formed of amaterial which is heat resistant and solvent resistant, such as acrylicresin, polyimide resin, or the like. The thickness of these organicmaterial bank layers 112 b is desirably in the range of from 0.1 to 3.5μm, and in particular may be about 2 μm. If their thicknesses are lessthan 0.1 μm, then the organic material bank layers 112 b become thinnerthan the total thickness of the positive hole injection/transport layerand the light emission layer which will be described hereinafter, andthis is not desirable, because there is a danger that the light emissionlayer might overflow from the upper opening portions 112 d. On the otherhand, if the thicknesses of the organic material bank layers 112 b areless than 0.1 μm, then the steps due to the upper opening portions 112 dbecome large, and this is not desirable, because it becomes impossibleto ensure the step coverage of the negative electrode 42 which is formedupon the organic material bank layer 112 b. Furthermore, if thethicknesses of the organic material bank layers 112 b are greater than0.2 μm, this is desirable from the point of view that it becomespossible to enhance the insulation with respect to the thin filmtransistors for drive 123.

Furthermore, both regions which exhibit hydrophilic characteristics andregions which exhibit hydrophobic characteristics are formed upon thebank portions 112.

The regions which exhibit hydrophilic characteristics are the firstlayered portions of the inorganic material bank layers 112 a and theelectrode surfaces 111 a of the picture element electrodes 111, andthese regions are surface processed so as to have hydrophiliccharacteristics by plasma processing using oxygen as the processing gas.On the other hand, the regions which exhibit hydrophobic characteristicsare the wall surfaces of the upper opening portions 112 d and the uppersurfaces 112 f of the organic material bank layers 112, and theseregions are surface processed so as to have hydrophobic characteristicsby plasma processing using Tetrafluoromethane or Tetrafluorocarbon asthe processing gas. It should be understood that it would also beacceptable to make the organic material bank layers from a materialwhich included a fluorinated polymer.

Next, as shown in FIG. 31, the functional layer 110 is made from apositive hole injection/transport layer 110 a which is superimposed overthe picture 1 element electrode 111, and a light emission layer 110 bwhich is formed adjacent to and over this positive holeinjection/transport layer 110 a. It should be understood that it wouldalso be acceptable to form yet another functional layer, adjacent to thelight emission layer 110 b, which was endowed with the function ofacting as an electron injection/transport layer and the like.

The positive hole injection/transport layer 110 a, along with beingendowed with the function of injecting positive holes into the lightemission layer 110 b, also is endowed with the function of transportingthese positive holes within the internal portion of this positive holeinjection/transport layer 110 a. By providing this type of positive holeinjection/transport layer 110 a between the picture element electrode111 and the light emission layer 110 b, the light emission efficiency ofthe light emission layer 110 b, and the characteristics of this displaycomponent such as its service lifetime and the like, are enhanced.Furthermore, in the light emission layer 110 b, the positive holes whichhave been injected from the positive hole injection/transport layer 110a and the electrons which have been injected from the negative electrode42 are united with one another, and thereby light emission is obtained.

The positive hole injection/transport layer 110 a is made up from flatportions 110 a 1 which are formed over the picture element electrodesurfaces 111 a which are positioned within the lower opening portions112 c, and peripheral edge portions 110 a 2 which are formed over thefirst superimposed layer portions 112 e of the inorganic material banklayers which are positioned within the upper opening portions 112 d.Furthermore, due to its structure, the positive hole injection/transportlayer 110 a is positioned over the picture element electrodes 111, andmoreover it is only formed between the inorganic material bank layers112 a, i.e. the lower opening portions 110 c (there are also possibleembodiments in which it is only made in the flat portions which havebeen previously described).

The thickness of these flat portions 110 a 1 is made to be constant, andto fall, for example, in the range from 50 to 70 nm.

If the peripheral edge portions 110 a 2 are formed, these peripheraledge portions 110 a 2, along with being positioned over the firstsuperimposed portions 112 e, are tightly adhered to the wall surfaces ofthe upper openings 112 d, in other words to the organic material banklayers 112 b.

Furthermore, the thickness of the peripheral edge portions 110 a 2 isthinner at their sides closer to the electrode surfaces 111 a, andincreases along the direction away from the electrode surfaces 111 a,and is at its thickest near to the wall surfaces of the lower openingportions 112 d.

The reason that the peripheral edge portions 110 a 2 exhibit the abovetype of shape, is because the positive hole injection/transport layer110 a is formed by discharging a first mixture material containing thesource material for the positive hole injection/transport layer and apolar solvent, into the opening portions 112, and then by eliminatingthe polar solvent by vaporization, and this vaporization of the polarsolvent principally takes place over the first superimposed layerportions 112 e of the inorganic material bank layers 112 a, so that thesource material for the positive hole injection/transport layer isthickened and deposited over these first superimposed layer portions 112e, so as to be concentrated therein.

Furthermore, the light emission layers 110 b are formed over thesurfaces of the flat portions 110 a 1 and the peripheral edge portions110 a 2 of the positive hole injection/transport layer 110 a, and theirthicknesses over the flat portions 112 a 1 are in the range of from 50to 80 nm.

The light emission layers 110 b are of three types—a red colored lightemission layer 110 b 1 which emits red (R) colored light, a greencolored light emission layer 110 b 2 which emits green (G) coloredlight, and a blue colored light emission layer 110 b 3 which emits blue(B) colored light; and these various light emission layers 110 b 1through 110 b 3 are, in this embodiment, arranged in stripe form.

As has been described above, since the peripheral edge portions 110 a 2of the positive hole injection/transport layers 110 a are tightlycontacted against the wall surfaces of the upper opening portions 112 d(the organic material bank layers 112 b), thus the light emission layers110 b do not directly contact against the organic material bank layers112 b. Accordingly, the possibility of water which is included as animpurity in the organic material bank layers 112 b shifting to the sideof the light emission layers 110 b can be positively blocked by theperipheral edge portions 110 a 2, and thus it is possible to preventoxidization of the light emission layers 110 b by such percolatingwater.

Furthermore, since the peripheral edge portions 110 a 2 are formed inuneven thickness over the first superimposed layer portions 112 e of theinorganic material bank layers, accordingly the peripheral edge portions110 a 2 come to be in the state of being insulated from the pictureelement electrodes 111 by the first superimposed layer portions 112 e,and thus positive holes are not injected from the peripheral edgeportions 110 a 2 into the light emission layers 110 b. Due to this, theelectric current only flows from the picture element electrodes 111 intothe flat portions 112 a, and it is possible to ensure that the transportof positive holes from the flat portions 112 a 1 into the light emissionlayers 110 b is even, so that, along with light only being emitted fromthe central portions of the light emission layers 110 b, also it ispossible to make the amount of light which is generated by the lightemission layers 10 b to be constant.

Yet further, since the inorganic material bank layers 112 a are extendedyet further towards the centers of the picture element electrodes 111than the organic material bank layers 112 b, accordingly it is possibleto perform trimming of the shapes of the portions where the pictureelement electrodes 111 and the flat portions 110 a 1 are connectedtogether by these inorganic material bank layers 112 a, and thus it ispossible to repress deviation in light generation strength between thevarious light emission layers 110 b.

Even further, since the electrode faces 111 a of the picture elementelectrodes 111 and the first superimposed layer portions 112 e of theinorganic material bank layers both exhibit hydrophilic characteristics,accordingly the functional layers 110 are uniformly sealed against thepicture element electrodes 111 and the inorganic material bank layers912 a, and the functional layer 110 does not become extremely thin overthe inorganic material bank layers 112 a, so that it is possible toprevent short circuiting between the picture element electrodes 111 andthe negative electrode 42.

Again, since the upper surfaces 112 f of the organic material banklayers 112 b and the wall surfaces of the upper opening portions 112 dboth exhibit hydrophobic characteristics, the tightness of contactbetween the functional layers 110 and the organic material bank layers112 b becomes low, and it does not happen that the functional layers 110are made to overflow from the opening portions 112 g.

Moreover, as the material for making the positive holeinjection/transport layer, for example, dispersion liquid of a mixtureof polythiophenederivetive etc., for instancepolyethylenedioxythiophene, and polystilenesuofonic acid etc.(PEDOT/PSS) may be used. Furthermore, as the material for making thelight emission layer 110 b, for example, polyfluorenederivative,polyphenylenederivative, polyvinylcarbazole, polythiophenederivative, ordoped materials by doping perylene group pigments, coumaline grouppigments, rhodamine group pigments, for instance, rublene, perylene,9,10-diphenylanthracene, tetraphenylbutadiene, neilred, coumalin 6,quinacridone with the above polymers may be used.

Next, the negative electrode 42 is formed over the entire surface of thelight emitting element portions 41, and, as a pair with the pictureelement electrodes 111, it fulfils the function of conducting electricalcurrent to the functional layers 110. This negative electrode 42 may bemade, for example, as a superposition of a calcium layer and an aluminumlayer. At this time, it is desirable to provide the one whose workfunction is the lower to the negative electrode on the side which iscloser to the light emission layer, and in particular, in thisembodiment, to directly contact it to the light emission layer 110 b, soas to fulfill the function of injecting electrons into the lightemission layer 110 b. Furthermore, it sometimes is the case that it isdesirable to provide LiF between the light emission layer 110 and thenegative electrode 42, since lithium fluoride is efficient at causinglight to be emitted from the material for the light emission layer.

Furthermore, the material for the red colored (R) and the green colored(G) light emission layers 110 b 1 and 110 b 2 is not limited to beinglithium fluoride; it would be acceptable to employ some other material.Accordingly, in this case, it would be acceptable to make only the bluecolored (B) light emission layer 110 b 3 from lithium fluoride, and tosuperimpose thereupon the other red colored (R) and the green colored(G) light emission layers 110 b 1 and 110 b 2 which were made from someother material than lithium fluoride. Furthermore, it would also beacceptable not to form any lithium fluoride over the red colored (R) andthe green colored (G) light emission layers 110 b 1 and 110 b 2, but tomake them only from calcium.

Moreover, the thickness of the lithium fluoride is desirably in therange of, for example, 2 to 5 nm, and in particular it may beapproximately 2 nm. Furthermore, the thickness of the calcium isdesirably in the range of, for example, 2 to 50 nm, and in particular itmay be approximately 20 nm.

Furthermore, since the aluminum of which the negative electrode 42 ismade reflects light which is emitted from the light emission layer 110 btowards the side of the base plate 32, it is desirable for it to includesome layer other than aluminum, such as an Ag layer or a superimposedcombination of Al and Ag, or the like. Furthermore, it is desirable forthe thickness of this layer to be within the range of, for example, 100to 1000 nm, and in particular it is desirable for it to be approximately200 nm.

Yet further, it would also be acceptable to provide a protective layerfor preventing oxidization made from SiO, SiO₂, SiN or the like upon thealuminum negative electrode 42.

Moreover, the sealing cover plate 604 may be provided over this lightemitting element which has been made in the above manner. As shown inFIG. 30(b), this sealing cover plate 604 may be adhered with the sealingresin 603, so as to form the display device 31.

—Method of Manufacture of the Display Device—

Next, a method of manufacture of this display device according to thispreferred embodiment of the present invention will be explained withreference to the figures.

A method of manufacture of the display device 31 of this preferredembodiment, for example, may consist of (1) a process of formation ofthe bank portions; (2) a process of plasma processing (which may includea process of hydrophilization or water repellentation); (3) a process offorming the positive hole injection/transport layer (a process offorming the functional layer); (4) a process of formation of the lightemission layer (a process of forming the functional layer); (5) aprocess of formation of the opposing electrode (the negative electrode);and (6) a process of sealing. It should be understood that the method ofmanufacture of the display device 831 is not necessarily limited to thecombination of the above processes performed in the above order;according to requirements, various ones of these processes could beomitted, or some others could be added.

(1) the Process of Formation of the Bank Portions

The process of formation of the bank portions is a process of formingthe bank portions 112 in predetermined positions upon the base plate 32.In these bank portions 112, the inorganic material bank layers 112 a areformed as first bank layers, and the organic material bank layers 112 bare formed as second bank layers. The method of formation of these banklayers will now be explained.

(1)-1 The Process of Forming the Inorganic Material Bank Layers 112 a

First, as shown in FIG. 32, the inorganic material bank layers 112 a areformed upon the substrate in the predetermined positions. Thesepositions in which the inorganic material bank layers 112 a are formedare upon the second inter layer insulating layer 144 b and upon theelectrode (here, the picture element electrode) 111. It should beunderstood that the second inter layer insulating layer 144 b is formedon top of the circuit element portion 44 in which the various componentssuch as the thin film transistors, the scan lines, the signal lines, andon are provided.

The inorganic material bank layers 112 a, for example, may be made asinorganic material layers using SiO2, TiO2 or the like. These materialsmay be formed, for example, using a CVD method, a coating method, aspattering method, a vacuum evaporation method, or the like.

Furthermore, it is desirable for the film thickness of the inorganicmaterial bank layers 112 a to be in the range from 50 to 200 nm, and inparticular it may be 150 nm.

First, the inorganic material bank layers 112 a are formed as aninorganic material layer over the entire surfaces of the inter layerinsulating layer 114 and the picture element electrode 111, and, afterthis, the inorganic material bank layers 112 a are formed by patterningthis inorganic material layer by a photolithographic method or the like,so as to create opening portions. These opening portions are located inpositions corresponding to the positions of formation of the electrodesurfaces 111 a of the picture element electrodes 111, and accordingly,as shown in FIG. 32, are provided as the lower opening portions 112 c.

At this time, the inorganic material bank layers 112 a are formed so asto overlay the peripheral edge portions (the one portions) of thepicture element electrodes 111. As shown in FIG. 32, it is possible tocontrol the light emission region of the light emission layer 110 bythus forming the inorganic material bank layers 112 a so that the oneportions of the picture element electrodes 111 and the inorganicmaterial bank layers 112 a overlap.

(1)-2 the Process of Forming the Organic Material Bank Layers 112 b

Next, the organic material bank layers 112 b are formed as second banklayers.

As shown in FIG. 33, the organic material bank layers 112 b are formedupon the inorganic material bank layers 112 a. These organic materialbank layers 112 b should be made from a material which is heat resistantand solvent resistant, such as, for example, acrylic resin, polyimideresin or the like. Using such a material, the organic material banklayers 112 b are formed by patterning employing a technique such asphotolithography or the like. It should be understood that the upperopening portions 112 d are formed in these organic material bank layers112 b during this patterning. These upper opening portions 112 d areprovided in positions which correspond to the positions of the electrodefaces 111 a and the lower opening portions 112 c.

It is desirable for the upper opening portions 112 d to be made, asshown in FIG. 33, wider than the lower opening portions 112 c which wereformed in the inorganic material bank layer 112 a. Furthermore, it isdesirable for the organic material bank layer 112 b to be formed astapered, in other words, it is desirable for the opening portions of theorganic material bank layers to be formed narrower than the width of thepicture element electrodes 111, while, at the uppermost surface of theorganic material bank layers 112 b, these organic material bank layers112 b are formed so as to have almost the same widths as the widths ofthe picture element electrodes 111. According to this, the first layersuperimposed portions 112 e which surround the lower opening portions112 c of the inorganic material bank layers 112 a come to be formed soas to extend further towards the centers of the picture elementelectrodes 111 than the organic material bank layers 112 b.

By juxtaposing together the upper opening portions 112 d which areformed in the organic material bank layers 112 b and the lower openingportions 112 c which are formed in the inorganic material bank layers112 a in this manner, the opening portions 112 g are formed so as topierce through the inorganic material bank layers 112 a and the organicmaterial bank layers 112 b.

Furthermore, it is desirable for the film thickness of the organicmaterial bank layers 112 b to be in the range from 0.1 to 3.5 μm, and inparticular it may be about 2 μm. The reason why this range is employedwill now be explained.

That is to say, if the thickness of the organic material bank layers 112b is less than 0.1 μm, the inorganic material bank layers 112 b becomethinner than the total of the thicknesses of the positive holeinjection/transport layer and the light emission layers which will bedescribed hereinafter, and there is a danger that the light emissionlayers 110 b will overflow from the upper opening portions 112 d, whichwould be most undesirable.

Furthermore, if the thickness of the organic material bank layers 112 bis greater than 3.5 μm, the steps become bigger than the upper openingportions 112 d, and this is not desirable, since it becomes impossibleto guarantee the step coverage of the negative electrode 42 at the upperopening portions 112 d. Furthermore, it is desirable for the thicknessof the organic material bank layers to be made to be greater than 2 μm,from the point of view of being able to enhance the degree of insulationbetween the negative electrode 42 and the thin film transistors 123 fordriving.

(2) The Plasma Processing Process

The following plasma processing process is performed with the objectiveof activating the surfaces of the picture element electrodes 111, andalso with the objective of performing surface processing of the surfacesof the bank portions 112. In particular, the activation process isperformed with the principal objectives of cleaning the surface of thepicture element electrodes 111 (ITO), and also of adjusting the workfunction thereof. Furthermore, a process of making the surfaces of thepicture element electrodes to be hydrophilic (a hydrophilizationprocess) and a process of making the surfaces of the bank portions 912to be hydrophobic (a water repellentation process) are performed.

This plasma processing process can generally, for example, be separatedinto the following processes: (2)-1 a preliminary heating up process;(2)-2 an activation processing process (a process of hydrophilization);(2)-3 a hydrophobic processing process (a process of waterrepellentation); and (2)-4 a process of cooling. It should be understoodthat the plasma processing process is not necessarily limited to thecombination of the above processes performed in the above order;according to requirements, various ones of these processes could beomitted, or some others could be added.

First, FIG. 34 shows a plasma processing device which is used for thisplasma processing process.

The plasma processing device 50 shown in FIG. 34 comprises a preliminaryheating processing chamber 51, a first plasma processing chamber 52, asecond plasma processing chamber 53, a cooling processing chamber 54,and a transport device 55 which transports the base plate 32 into eachof these processing chambers 51 through 54. These processing chambers 51through 54 are arranged radially around the transport device 55, whichis at the center.

First, the overall process which employs these devices will beexplained.

The preliminary heating up process is performed in the preliminaryheating processing chamber 51 shown in FIG. 34. And the base plate 32which has been transported from the previous bank portion formationprocess is heated up to a predetermined temperature in this preliminaryheating processing chamber 51.

After the preliminary heating up process, a hydrophilization processingprocess and a water repellentation processing process are performed.That is to say, the work-piece is transported in order to the firstplasma processing chamber 52 and then to the second plasma processingchamber 53, and plasma processing is performed upon the bank portions112 in each of these plasma processing chambers 52 and 53, so as tosubject them to hydrophilization. After this hydrophilization process,water repellentation processing is performed. After this waterrepellentation process, the work-piece is transported to the coolingprocessing chamber 54, and in this cooling processing chamber 54 thework-piece is cooled to room temperature. After this cooling process,the work-piece is transported by the transport device to the positivehole injection/transport layer formation process, which is the nextmajor process in order to be performed.

In the following, these various processes will be explained in detail.

(2)-1 The Preliminary Heating Up Process

This preliminary heating up process is performed by the preliminaryheating processing chamber 51. In this processing chamber 51, the baseplate 832 which includes the bank portions 112 is heated up to apredetermined temperature.

As a method of heating up the base plate 32, for example, the means maybe employed of fitting a heater upon a stage upon which the base plate32 is mounted in the processing chamber 51, and of heating up the baseplate 32 together with the stage by this heater. It should be understoodthat it would also be possible to utilize various other methods, asappropriate.

The base plate 32 is heated up in the preliminary heating processingchamber 51 to, for example, a temperature of 70 degree Celsius to 80degree Celsius. This temperature is the processing temperature for theplasma processing which is the next process, and the base plate 32 isheated up as a preparation for this next process, with the objective ofeliminating variations in the temperature of the base plate 32.

If hypothetically this preliminary heating up process were not to beapplied, then, during the plasma processing process, the processingwould be performed while the temperature was always varying from thestart of the process to the end of the process, as the base plate 32 washeated up from room temperature to the above type of temperature.Accordingly, due to performing the plasma processing while thework-piece temperature was varying, there would be a possibility thatthe characteristic of the resulting organic electro-luminescent displayelement might be uneven. Therefore the preliminary heating up process isperformed, in order to maintain constant processing conditions, and inorder to obtain a uniform characteristic for the resultant product.

In this connection, when, in the plasma processing process, ahydrophilization process or a water repellentation process is performedin the state in which the base plate 32 is held upon the stage withinthe first and second plasma processing devices 52 and 53, it isdesirable for the preliminary heating up temperature to be almost thesame temperature as the temperature of the sample stage 56 upon whichthe hydrophilization process or the water repellentation process iscontinuously performed.

Thus, by raising the temperature of the sample stage within the firstand second plasma processing devices 52 and 53 so as to performpreliminary heating up of the base plate 32 in advance to a temperatureof, for example, 70 degree Celsius to 80 degree Celsius, it is possibleto keep the plasma processing conditions almost constant from directlyafter the start of the processing until just before the end of theprocessing, even in the case that plasma processing is being performedcontinuously upon a large number of work-pieces. Due to this, theprocessing conditions upon the surface of the base plate 832 are madeconstant, and it is possible to keep the dampness of the material ofwhich the bank portions 112 are composed more uniform, so that itbecomes possible to manufacture a display device which is of constantquality.

Furthermore, by thus performing preliminary heating up of the base plate32 in advance, it becomes possible to shorten the processing time periodwhich is required for the subsequent plasma processing.

(2)-2 the First Activation Processing Process (the Process ofHydrophilization)

Next, activation processing is performed in the first plasma processingchamber 52. This activation processing includes adjusting andcontrolling the work function of the picture element electrodes 111,cleaning the surfaces of the picture element electrodes 111, andperforming hydrophilization processing of the surfaces of the pictureelement electrodes 111.

As a hydrophilization process, plasma processing is performed in anambient atmosphere using oxygen as the processing gas (so called O₂plasma processing). In FIG. 35, this first plasma processing process isschematically shown. As shown in FIG. 35, the base plate 32 includingthe bank portions 112 is loaded upon the sample stage 56 which includesa heater, and a plasma electrical discharge electrode 57 is arranged tooppose the base plate 32 at a distance or gap interval of approximately0.5 to 2 mm from the upper side of the base plate 832. The base plate832 is transported by the sample stage 56 at a predetermined transportspeed in the direction of the arrow in the figure while being heated upby the sample stage 56, and during this transportation the base plate 32is irradiated with oxygen in the plasma state.

The conditions of this O₂ plasma processing, for example, may be: plasmapower 100 to 800 kW, oxygen gas flow rate 50 to 100 ml/min, base platetransport speed 0.5 to 10 mm/sec, and work-piece temperature 70 degreeCelsius to 90 degree Celsius. It should be understood that the heatingup by the sample stage 56 is principally performed in order to maintainthe temperature of the base plate 32 which has been previously subjectedto preliminary heating up, as explained above.

By this O₂ plasma processing, as shown in FIG. 36, the electrodesurfaces 111 a of the picture element electrodes 111, the firstsuperimposed layer portions 121 e of the inorganic material bank layers112 a, and the wall surfaces of the upper opening portions 112 d and theupper surfaces 112 f of the organic material bank layers 912 b areprocessed to be hydrophilic.

Hydroxyl groups are introduced into these various surfaces by thishydrophilization processing, so as to endow them with hydrophiliccharacteristics.

The portions which have been subjected to hydrophilization processingare shown in FIG. 36 by the single dotted broken lines.

It should be understood that this O₂ plasma processing does not onlyimpart a hydrophilic characteristic to the subject surfaces; by theabove described processing, it also serves to clean the ITO whichconstitutes the picture element electrodes, and also to adjust its workfunction.

(2)-3 the Second Hydrophobic Processing Process (the Process of WaterRepellentation)

Next, as a water repellentation process, plasma processing is performedin the second plasma processing chamber 53 in an ambient atmosphere,using tetrafluoromethane as the processing gas (so called CF₄ plasmaprocessing). The internal structure of the second plasma processingchamber 53 is the same as the internal structure of the first plasmaprocessing chamber 52 shown in FIG. 35. In other words, the base plate32 is transported by the sample stage at a predetermined transport speedwhile being heated up by the sample stage 56, and during thistransportation the base plate 32 is irradiated with tetrafluoromethane(CF₄) in the plasma state.

The conditions of this CF₄ plasma processing, for example, may be:plasma power 100 to 800 kW, CF₄ gas flow rate 50 to 100 ml/min,work-piece transport speed 0.5 to 1020 mm/sec, and work-piecetemperature 70 degree Celsius to 90 degree Celsius. It should beunderstood that, just as was the case in the first plasma processingchamber 52, the heating up by the sample stage is principally performedin order to maintain the temperature of the base plate 32 which has beenpreviously subjected to preliminary heating up, as explained above.

Moreover, it should be understood that the processing gas is not limitedto being tetrafluoromethane; it would also be possible to utilize someother fluorocarbon type gas.

By this CF₄ plasma processing, as shown in FIG. 37, the wall surfaces ofthe upper opening portions 112 d and the upper surfaces 112 f of theorganic material bank layers are processed to be hydrophobic. Fluorinegroups are introduced into these various surfaces by this waterrepellentation processing, so as to endow them with hydrophiliccharacteristics. The portions which have been subjected to waterrepellentation processing are shown in FIG. 37 by the double dottedbroken lines. The organic material such as acrylic resin, polyimideresin or the like of which the organic material bank layers 112 b arecomposed can be easily hydrophobized by irradiation with fluorocarbon inthe plasma state. Furthermore, this preferred embodiment of the presentinvention is particularly effective, because the particularcharacteristic is exhibited that the portions which have been subjectedto preliminary processing with O₂ plasma can more easily be fluoridized.

It should be noted that, although the electrode surfaces 111 a of thepicture element electrodes 111 and the first superimposed layer portions112 e of the inorganic material bank layers 112 a are also subjected tothe influence of this CF₄ plasma processing to a greater or lesserextent, very little influence is exerted upon their dampness. In FIG.37, The portions which exhibit hydrophilic characteristics are shown bythe single dotted broken lines.

(2)-4 The Process of Cooling

Next, as a cooling process, the base plate 32 which was heated up forthe plasma processing processes is cooled to a controlled temperatureusing the cooling processing chamber 54. In other words, this process isperformed for cooling the work-piece to the suitable operatingtemperature for a liquid drop discharge process (a functional layerformation process) which is the subsequent process.

This cooling processing chamber 54 comprises a plate for holding thebase plate 32, and this plate is made to include a water cooling device,so as to cool the base plate 32.

Furthermore, by cooling the base plate 32 after the plasma processing toroom temperature or to a predetermined temperature (for example, theoperating temperature for the liquid drop discharge process), thetemperature of the base plate 32 becomes constant in the subsequentprocess of formation of the positive hole injection/transport layer, andit is possible to perform the subsequent processes at an eventemperature with the base plate 32 not being subject to temperaturevariations. Accordingly, by adding this type of cooling process, it ispossible to form uniformly the material which is discharged by thedischarge means such as a liquid drop discharge method or the like.

For example, when discharging a first composite material which includesa material for forming the positive hole injection/transport layer, itis possible to discharge this first composite material continuously at aconstant volume, so that it is possible to form a uniform positive holeinjection/transport layer.

In the above described plasma processing processes, it is possibleeasily to provide the desired regions of hydrophilic characteristics andthe regions of hydrophobic characteristics upon the bank portions 112,by processing the organic material bank layers 112 b and the inorganicmaterial bank layers 112 a by O₂ plasma processing and CF₄ plasmaprocessing in sequence.

It should be understood that the plasma processing device which is to beused for the plasma processing processes is not to be considered asbeing limited to the device shown in FIG. 34; for example, it would alsobe possible to utilize the plasma processing device 60 shown in FIG. 38.

The plasma processing device 60 shown in FIG. 38 comprises a preliminaryheating processing chamber 61, a first plasma processing chamber 62, asecond plasma processing chamber 63, a cooling processing chamber 64,and a transport device 65 which transports the base plate 32 into eachof these processing chambers 61 through 64; and these processingchambers 61 through 64 are arranged linearly upon both sides of thetransport direction of the transport device 65 (i.e. on both sides ofthe direction shown by the arrow in the figure).

With this plasma processing device 60, in the same manner as with theplasma processing device 50 which was shown in FIG. 34, the base plate32 which has been transported from the bank portion formation process istransported in order to the preliminary heating processing chamber 61,the first plasma processing chamber 62, the second plasma processingchamber 63, and the cooling processing chamber 64, and, after the sameprocesses have been performed by these various processing chambers inthe same manner as described above, the base plate 32 is transported tothe subsequent positive hole injection/transport layer formationprocess.

Furthermore, for the above described plasma device, rather than a devicewhich operated in the ambient atmosphere, a plasma processing devicecould also be utilized which operated in a vacuum.

(3) The Process of Forming the Positive Hole Injection/Transport Layer(the Process of Forming the Functional Layer)

In the process of formation of the positive hole injection/transportlayer, a first composite material which includes a material for formingthe positive hole injection/transport layer is discharged over thepicture electrode surfaces 111 a by utilizing, for example, a liquiddrop discharge device for liquid drop discharge. Drying processing andheat processing are performed after this discharge process, and therebythe positive hole injection/transport layer 110 a is formed over thepicture element electrodes 111 and the inorganic material bank layers112 a. It should be understood that the inorganic material bank layers112 a upon which this positive hole injection/transport layer 110 a hasbeen formed are termed the first superimposed layer portions 112 e.

It is desirable for the following processes, which include this positivehole injection/transport layer formation process, to be performed in anatmosphere which contains no water or oxygen. For example, it isdesirable for them to be performed in an inert gas atmosphere such as anitrogen atmosphere, an argon atmosphere, or the like.

It should be understood that the positive hole injection/transport layermay not be formed over the first superimposed layer portions 112 e. Inother words, there are some embodiments of the present invention inwhich the positive hole injection/transport layer is only formed overthe picture element electrodes 111.

The method of manufacture by liquid drop discharge is as follows.

As a desirable type of liquid drop discharge head for use in the methodof manufacture of a display device according to this preferredembodiment of the present invention, a head unit 120 (refer to FIG. 39)which has almost the same basic structure as the head unit according tothe previous preferred embodiment shown in FIG. 2 may be used.Furthermore, with regard to the arrangement of the work-piece and theabove described head unit, the arrangement shown in FIG. 39 isdesirable.

In the liquid drop discharge device shown in FIG. 39, there is includeda head unit 120 which has almost the same structure as the one shown inFIG. 2. Furthermore, the reference symbol 1115 denotes a stage uponwhich the base plate 32 is mounted, while the reference symbol 1116denotes a pair of guide rails which guide the stage 1115 along the Xaxis direction in the figure (the main scanning direction). And the headunit 120 is arranged to be capable of being shifted, via a supportmember 1111, in the Y axis direction in the figure (the widthwisescanning direction) along guide rails 1113, and moreover this head unit120 is arranged to be rotatable around the θ axis direction as shown inthe figure, so that ink jet heads 121 may be inclined to a predeterminedangle with respect to the main scanning direction.

The base plate 32 shown in FIG. 39 is made as a plurality of chipsdisposed upon a motherboard. In other words, a single region containingchips corresponds to a single display device. Although in the figure itis shown that three display regions 32 a have been formed, this is notto be considered as being limitative of the present invention. Forexample, when applying the composite material upon the left side displayregion 32 a upon the base plate 32, along with shifting the heads 121along the guide rails 1113 to the left side in the figure, they are alsoshifted along the guide rails 1116 to the upper side in the figure, andthe composite material is applied while scanning the base plate 32. Nextthe heads 121 are shifted to the central position in the figure, and thecomposite material is applied to the central display region 32 a of thework-piece. The same procedure, mutatis mutandis, is applied forapplying the composite material to the right side display region 32 a inthe figure.

It should be understood that the head unit and the liquid drop dischargedevice shown in FIG. 39 are not limited to use in the positive holeinjection/transport layer formation process; they may also be used forthe light emission layer formation process.

FIG. 40 shows the state in which a ink jet head 121 is being scannedwith respect to the base plate 32. As shown in this figure, although thefirst composite material is discharged while relatively shifting the inkjet heads 121 along the X direction in the figure, at this time, thedirection Z of arrangement of the nozzles is in the state of beinginclined with respect to the main scanning direction (along the Xdirection). By arranging the direction of arrangement of the nozzles nof the ink jet head 121 to be inclined with respect to the main scanningdirection in this manner, it is possible to make the pitch of thenozzles correspond to the pitch of the picture element regions A.Furthermore, by adjusting the angle of inclination, it is possible tomake the pitch of the nozzles correspond to the pitch of any type ofpicture element regions A.

Next, the process of forming the positive hole injection/transport layer110 a in each of the picture element regions A by scanning the ink jethead 121 will be explained. For this process there are threepossibilities: (1) a method which is performed with a single scanningepisode of the ink jet head 121; (2) a method which is performed with aplurality of scanning episodes of the ink jet head 121, and moreover byusing a plurality of nozzles during those scanning episodes; and (3) amethod which is performed with a plurality of scanning episodes of theink jet head 121, and moreover by using a separate nozzle in each ofthose scanning episodes. In the following, each of these three methods(1) through (3) will be explained in order.

(1) a Method Performed with a Single Scan of the Ink Jet Head 121

FIG. 41 is a process diagram showing this process when forming thepositive hole injection/transport layer 110 a upon the various pictureelement regions A1 . . . with a single scan of the ink jet head 121.FIG. 41(a) shows the situation after the ink jet head 121 has scannedfrom the position shown in FIG. 41 along the X direction in the figure;FIG. 41(b) shows the situation when, from the situation shown in FIG.41(a), the ink jet head 121, along with scanning a little along the Xdirection in the figure, has also shifted in the direction opposite tothe Y direction in the figure; and FIG. 41(c) shows the situation when,from the situation shown in FIG. 41(b), the ink jet head 121, along withscanning a little along the X direction in the figure, has also shiftedin the Y direction in the figure.

Furthermore, in FIG. 44 there is shown a schematic sectional view of thepicture element regions A and of the ink jet head. Six of the nozzleswhich are provided to one portion of the ink jet head 121 are shown inFIG. 41 and are designated by the reference symbols n1 a through n3 b.Three of these six nozzles, the ones designated as n1 a, n2 a, and n3 a,are arranged so as to be respectively positioned over picture elementregions A1 through A3 when the ink jet head 121 is shifted in the Xdirection as seen in the figure, while the other three of the sixnozzles, i.e. the ones designated as n1 b, n2 b, and n3 b, are arrangedso as to be positioned between adjacent ones of the picture elementregions A1 through A3 when the ink jet head 121 is shifted in the Xdirection as seen in the figures.

In FIG. 41(a), among the nozzles which are included in the ink jet head121, the first composite material which is included in the materialwhich is to form the positive hole injection/transport layer isdischarged upon the picture element regions A1 through A3 from the threenozzles n1 a through n3 a. It should be understood that in thispreferred embodiment of the present invention the first compositematerial is discharged by scanning the ink jet head 121 over the baseplate 32, but it would also be acceptable, as an alternative, to scanthe base plate 32 under the ink jet head 121.

Furthermore, it would also be possible to discharge the first compositematerial by shifting the ink jet head 121 and the base plate 32relatively to one another. Moreover, it should be understood that thispoint explained above also applies to the other processes describedhereinafter in relation to this liquid drop discharge head.

The discharge from the ink jet head 121 takes place as described below.That is to say, as shown in FIG. 41(a) and in FIG. 44, the nozzles n1 athrough n3 a which are formed in the ink jet head 121 are arranged tooppose the electrode surfaces 111 a, and an initial liquid drop 110 c 1of the first composite material is discharged from each of the nozzlesn1 a through n3 a. The picture element regions A1 through A3 are formedfrom the picture element electrodes 111 and the banks 112 whichcompartment around the peripheries of the picture element electrodes111, and the initial liquid drops 110 c 1 of the first compositematerial are discharged from the nozzles n1 a through n3 a against thesepicture element regions A1 through A3 with the amount of liquid per eachdrop being controlled.

Next, as shown in FIG. 41(b), while scanning the ink jet head 121 alittle along the X direction as seen in the figure, each of the nozzlesn1 b through n3 b is positioned over the corresponding one of thepicture element regions A1 through A3 respectively by shifting the inkjet head 121 along the direction opposite to the Y direction as seen inthe figure. And second liquid drops 110 c 2 of the first compositematerial are discharged against the picture element regions A1 throughA3 from the nozzles n1 b through n3 b respectively.

Furthermore, as shown in FIG. 41(c), while scanning the ink jet head 121a little along the X direction as seen in the figure, each of thenozzles n1 a through n3 a is again positioned over the corresponding oneof the picture element regions A1 through A3 respectively by shiftingthe ink jet head 121 along the Y direction as seen in the figure. Andthird liquid drops 110 c 3 of the first composite material aredischarged against the picture element regions A1 through A3 from thenozzles n1 a through n3 a respectively.

By doing this, i.e. by shifting the ink jet head a little to and froalong the Y direction as seen in the figure while scanning the ink jethead 121 along the X direction as seen in the figure, liquid drops ofthe first composite material are discharged against a single pictureelement region A in order from two of the nozzles. The total number ofliquid drops which are discharged against a single picture elementregion A can be in the range, for example, from 6 to 20, but this rangewill vary according to the area of the picture elements, and in somecircumstances the most appropriate number of drops may be greater orless than this stated range. The total amount of the first compositematerial which is discharged against each of the picture element regions(upon each of the electrode surfaces 111 a) is determined according tothe sizes of the lower opening portions 112 c and the upper openingportions 112 d, according to the thickness of the positive holeinjection/transport layer which it is desired to form, according to theconcentration of the material for forming the positive holeinjection/transport layer within the first composite material, and thelike.

In this manner, for the case of forming the positive hole/transportlayer in a single scan, the nozzles are changed over every time thefirst composite material is discharged, and, since the first compositematerial is discharged against each of the picture element regions A1through A3 from two of the nozzles, accordingly, by comparison with thecase of discharging the first composite material against each of thepicture element regions A a plurality of times from a single nozzle asin the prior art, it is possible to perform mutual cancellation betweenundesirable deviations in the discharge amounts between the nozzles, sothat undesirable deviations in the discharge amounts of the firstcomposite material upon each of the picture element electrodes 111 . . .are reduced, and it is possible to form the positive holeinjection/transport layer of a uniform film thickness. By doing this, itis possible to ensure that the amount of emitted light from each of thepicture elements should be uniform, and accordingly it is possible tomanufacture a display device which is endowed with a superior displayquality.

(2) A Method Performed with a Plurality of Scans of the Ink Jet Head121, and by Using a Plurality of Nozzles During Those Scans

FIG. 42 is a process diagram showing this process when forming thepositive hole injection/transport layer 110 a upon the various pictureelement regions A1 . . . with three scanning episodes of the ink jethead 121. FIG. 42(a) shows the situation after the ink jet head 121 hascompleted its first scanning episode; FIG. 42(b) shows the situationafter the ink jet head 121 has completed its second scanning episode;and FIG. 42(c) shows the situation after the ink jet head 121 hascompleted its third and last scanning episode.

In the first scanning episode, among the various nozzles of the ink jethead 121 shown in FIG. 41, the initial liquid drops 110 c of the firstcomposite material are discharged from the nozzles n1 a through n3 aagainst the picture element regions A1 through A3 which these nozzlesrespectively oppose, and then the ink jet head 121 is shifted a littlein the widthwise scanning direction and the second liquid drops 110 c 2of the first composite material are discharged from the nozzles n1 bthrough n3 b against the picture element regions A1 through A3 whichthese nozzles respectively oppose. By doing this, as shown in FIG.42(a), the two liquid drops 110 c 1 and 110 c 2 are discharged againsteach of the picture element regions A1 through A3. It should beunderstood that each of these first and second liquid drops 110 c 1 and110 c 2 may be discharged against its one of the picture element regionsA1 through A3 with an interval being opened up between them, as shown inFIG. 42(a); or, alternatively, they may be discharged over one another.

Next, in the second scanning episode, in the same manner as during thefirst scanning episode, the third liquid drops 110 c 3 of the firstcomposite material are discharged from the nozzles n1 a through n3 aagainst the picture element regions A1 through A3 which these nozzlesrespectively oppose, and then again the ink jet head 121 is shifted alittle in the widthwise scanning direction and the fourth liquid drops110 c 4 of the first composite material are discharged from the nozzlesn1 b through n3 b against the picture element regions A1 through A3which these nozzles respectively oppose. By doing this, as shown in FIG.42(b), the further two liquid drops 110 c 3 and 110 c 4 are dischargedagainst each of the picture element regions A1 through A3. It should beunderstood that each of these third and fourth liquid drops 110 c 3 and110 c 4 may be discharged against its one of the picture element regionsA1 through A3 with an interval being opened up mutually between them andalso with an interval being opened up between them and the first andsecond liquid drops 110 c 1 and 110 c 2 so that none of these fourliquid drops are mutually superimposed, as shown in FIG. 42(b); or,alternatively, they may be discharged over one another and over thefirst and second liquid drops 110 c 1 and 110 c 2.

Next, in the third scanning episode, in the same manner as during thefirst and second scanning episodes, the fifth liquid drops 110 c 5 ofthe first composite material are discharged from the nozzles n1 athrough n3 a against the picture element regions A1 through A3 whichthese nozzles respectively oppose, and then again the ink jet head 121is shifted a little in the widthwise scanning direction and the sixthliquid drops 110 c 6 of the first composite material are discharged fromthe nozzles nib through n3 b against the picture element regions A1through A3 which these nozzles respectively oppose. By doing this, asshown in FIG. 42(c), the further two liquid drops 110 c 5 and 110 c 6are discharged against each of the picture element regions A1 throughA3. It should be understood that each of these fifth and sixth liquiddrops 110 c 5 and 110 c 6 may be discharged against its one of thepicture element regions A1 through A3 with an interval being opened upmutually between them and also with an interval being opened up betweenthem and the first four liquid drops 110 c 1 through 110 c 4 so thatnone of these six liquid drops are mutually superimposed, as shown inFIG. 42(c); or, alternatively, they may be discharged over one anotherand over the first through the fourth liquid drops 110 c 1 through 110 c4.

Since in this manner, when forming the positive hole injection/transportlayer with a plurality of scans, the nozzles are changed over betweeneach scan and the next, and the first composite material is dischargedagainst each of the picture element regions A1 through A3 from its owntwo ones of the nozzles, accordingly, by comparison with the case ofdischarging the first composite material against each of the pictureelement regions a plurality of times from a single nozzle as in theprior art, it is possible to perform mutual cancellation betweenundesirable deviations in the discharge amounts between the nozzles, sothat undesirable deviations in the discharge amounts of the firstcomposite material upon each of the picture element electrodes 111 . . .are reduced, and it is possible to form the positive holeinjection/transport layer of a uniform film thickness. By doing this, itis possible to ensure that the amount of emitted light from each of thepicture elements is maintained as uniform, and accordingly it ispossible to manufacture a display device which is endowed with asuperior display quality.

(3) A Method Performed with a Plurality of Scans of the Ink Jet Head121, and by Using a Different Nozzle in Each of Those Scans

FIG. 43 is a process diagram showing this process when forming thepositive hole injection/transport layer 110 a upon the various pictureelement regions A1 . . . with two scanning episodes of the ink jet head121. FIG. 43(a) shows the situation after the ink jet head 121 hascompleted its first scanning episode; FIG. 43(b) shows the situationafter the ink jet head 121 has completed its first scanning episode; andFIG. 43(c) shows another possible situation after the ink jet head 121has completed its first and second scanning episodes.

In the first scanning episode, among the various nozzles of the ink jethead 121 shown in FIG. 41, the initial liquid drops 110 c 1 and thesecond and third liquid drops 110 c 2, and 110 c 3 of the firstcomposite material are discharged in order from each of the nozzles n1 athrough n3 a against each of the picture element regions A1 through A3which these nozzles respectively oppose. By doing this, as shown in FIG.41(a), the three liquid drops 110 c 1, 110 c 2, and 110 c 3 aredischarged against each of the picture element regions A1 through A3. Itshould be understood that each of these liquid drops 110 c 1 through 110c 3 may be discharged against its one of the picture element regions A1through A3 with an interval being opened up between them, as shown inFIG. 41(a); or, alternatively, they may be discharged over one another,so that they are mutually superimposed.

Then, in the second scanning episode, the ink jet head 121 is shifted alittle in the widthwise scanning direction and the fourth, fifth, andsixth liquid drops 110 c 4, 110 c 5, and 110 c 6 of the first compositematerial are discharged in order from the nozzles n1 b through n3 bagainst the picture element regions A1 through A3 which these nozzlesrespectively oppose. By doing this, as shown in FIG. 43(b), the furtherthree liquid drops 110 c 4 through 110 c 6 are discharged against eachof the picture element regions A1 through A3. It should be understoodthat each of these fourth through sixth liquid drops 110 c 4, 110 c 5,and 110 c 6 may be discharged against its one of the picture elementregions A1 through A3 with an interval being opened up mutually betweenthem and also with an interval being opened up between them and thefirst three liquid drops 110 c 1 through 110 c 3 so that none of thesesix liquid drops are mutually superimposed, as shown in FIG. 43(b); or,alternatively, they may be discharged over one another and over thefirst through the third liquid drops 110 c 1 through 110 c 3.

Furthermore, FIG. 43(c) shows a different situation after the first andsecond scanning episodes. In FIG. 43(c) the number of scanning episodesis supposed to have been two, and, with regard to the point that thefirst through the third liquid drops are discharged in the firstscanning episode, and that, in the second scanning episode, the fourththrough the sixth liquid drops are discharged from different ones of thenozzles after the ink jet head 121 has been shifted, the situation isthe same as in the case of FIG. 43(a) and FIG. 43(b).

However the point in which the situation of FIG. 43(c) differs from thesituation of FIGS. 43(a) and 43(b) is that the discharge position ofeach of the liquid drops is different. In detail, in FIG. 43(c), theliquid drops 110 c 1 through 10 c 3 which are discharged in the firstscanning episode are all located in the lower half portion in the figureof each of the picture element regions A1 through A3, while the liquiddrops 110 c 4 through 110 c 6 which are discharged in the secondscanning episode are all located in the upper half portion in the figureof each of the picture element regions A1 through A3; in other words,the liquid drops 110 c 1 through 110 c 3 which are discharged in thefirst scanning episode are not interleaved with the liquid drops 110 c 4through 110 c 6 which are discharged in the second scanning episode, aswas the case with the process shown in FIGS. 43(a) and 43(b).

It should be understood that although, in FIGS. 42 and 43, the totalnumber of liquid drops which are discharged against a single pictureelement region A was supposed to be six, it may be in the range, forexample, from 6 to 20; but, since this range will vary according to thearea of the picture elements, in some circumstances the most appropriatenumber of drops may be greater or less than this stated range. The totalamount of the first composite material which is discharged against eachof the picture element regions (i.e., upon each of the electrodesurfaces 111 a) is determined according to the sizes of the loweropening portions 112 c and the upper opening portions 112 d, accordingto the thickness of the positive hole injection/transport layer which itis desired to form, according to the concentration of the material forforming the positive hole injection/transport layer within the firstcomposite material, and the like.

Since in this manner, when forming the positive hole injection/transportlayer with a plurality of scanning episodes, the nozzles are changedover between each scan and the next, and the first composite material isdischarged against each of the picture element regions A1 through A3from its own two ones of the nozzles, accordingly, by comparison withthe case of discharging the first composite material against each of thepicture element regions A a plurality of times from a single nozzle asin the prior art, it is possible to perform mutual cancellation betweenundesirable deviations in the discharge amounts between the nozzles, sothat undesirable deviations in the discharge amounts of the firstcomposite material upon each of the picture element electrodes 111 . . .are reduced, and it is possible to form the positive holeinjection/transport layer of a uniform film thickness. By doing this, itis possible to ensure that the amount of emitted light from each of thepicture elements is maintained as uniform, and accordingly it ispossible to manufacture a display device which is endowed with asuperior display quality.

It should be understood that it would be acceptable, when performingscanning of the ink jet head 121 a plurality of times, to perform eachpass of the ink jet head 121, i.e. each scan, in the same direction; or,alternatively, each pass of the ink jet head 121 might be performed inan opposite direction to the previous one.

As shown in FIG. 44, the liquid drops 110 c of the first compositematerial which have been discharged from the ink jet head 121 finallyspread out over the electrode surfaces 111 a and the first superimposedlayer portions 112 e which have been subjected to hydrophilicprocessing, and fill up the lower opening portions 112 c and the upperopening portions 112 d. On the 1

other hand, even if one of the liquid drops 110 c of the first compositematerial has wandered from its predetermined discharge position and hasbeen discharged against an upper surface 112 f, the upper surface 112 fis not wetted by this first composite material drop 110 c, and the firstcomposite material drop 110 c is shed off from the upper surface 112 fand finally slides to one of the lower opening portions 112 c or one ofthe upper opening portions 112 d.

As the first composite material which may be used here, for example, itis possible to utilize a composite material consisting of a mixture ofpolythiophene-derivetive, for instance polyethylenedioxithiophene(PEDOT) or the like, and polystyrenesulfonic acid (PSS) or the likedissolved in a polar solvent. As such a polar solvent, for example, itis possible to suggest isopropyl alcohol (IPA), normalbutanol,γ-butyrolactone, N-methylpyrolidone (NMP),1,3-dimethyl-2-imidazolidinone (DMI), and its derivative, carbitol,buthylcarbitolacetate, glycolethers, or the like.

In more concrete terms, as an exemplary composition for the firstcomposite material, it is possible to utilize a material consisting of amixture of PEDOT and PSS (with the PEDOT/PSS ratio being 1:20) to theamount of 22.4% by weight, PSS to the amount of 1.44% by weight, IPA tothe amount of 10% by weight, NMP to the amount of 27.0% by weight, andDMI to the amount of 50% by weight. It should be understood that it isdesirable for the viscosity of the first composite material to be in therange from 2 to 20 cPs, and in particular it is desirable for it to bein the range from 4 to 12 cPs.

By using the above described first composite material, it is possible toperform stable discharge through the discharge nozzles H2, without anydanger of occurrence of blockages.

Moreover, with regard to the material for forming the positive holeinjection/transport layer, it will be acceptable to use the samematerial for each of the red (R), green (G), and blue (B) light emissionlayers 110 b 1 through 110 b 3; or, alternatively, it could be differentfor each of these light emission layers.

Next, a drying process such as the one shown in FIG. 45 is performed.

By performing this drying process, the first composite material is driedafter having been discharged, the polar solvent which was contained inthe first composite material is vaporized, and thereby the positive holeinjection/transport layer 110 a is formed.

When performing this drying process, the vaporization of the polarsolvent which is contained in the first composite material drops 110 cprincipally occurs at positions which are close to the inorganicmaterial bank layers 112 a and the organic material bank layers 112 b,and the material which constitutes the positive hole injection/transportlayer is thickened and deposited along with the vaporization of thepolar solvent.

Due to this, as shown in FIG. 45, the peripheral edge portions 110 a 2which are made from the material which constitutes the positive holeinjection/transport layer are formed over the first superimposed layerportions 112 e. These peripheral edge portions 110 a 2 closely adhere tothe wall surfaces of the upper opening portions 112 d (the organicmaterial bank layers 112 b), and their thickness becomes thinner towardsthe electrode surfaces 111 a, while they become thicker away from theelectrode surfaces 111 a, in other words towards the organic materialbank layers 112 b.

Furthermore, at the same time as this is happening, the vaporization ofthe polar solvent takes place over the electrode surfaces 111 a due tothe drying process, and due to this the flat portions 110 a 1 are formedover the electrode surfaces 111 a from the material which is toconstitute the positive hole injection/transport layer. Since the speedof vaporization of the polar solvent over the electrode surfaces 111 ais almost uniform, the material which is to constitute the positive holeinjection/transport layer is thickened almost uniformly over theelectrode surfaces 111 a, and due to this the flat portions 110 a areformed of substantially uniform thickness.

By doing this, the positive hole injection/transport layer 110 a whichconsists of the peripheral edge portions 10 a 2 and the flat portions110 a 1 is formed.

It should be understood that a variant preferred embodiment would alsobe acceptable, as an alternative, in which the peripheral edge portions110 a 2 were not formed, but the positive hole injection/transport layerwas only formed over the electrode surfaces 111 a.

The above described drying procedure is performed, for example, in anitrogen atmosphere, at room temperature, and at a pressure of, forexample, approximately 133.3 to 13.3 Pa (1 to 0.1 torr). If the pressurewere to be reduced abruptly, the first composite material drops 110 cwould be caused to collide with one another, which would be undesirable;and accordingly it is desirable to reduce the pressure slowly andsteadily. Furthermore, it the temperature is raised to a hightemperature, the speed of vaporization of the polar solvent would beelevated to a level which would be undesirable, and it would becomeimpossible to form an even positive hole injection/transport layer.Accordingly a working temperature in the range of from 30 degree Celsiusto 80 degree Celsius is considered to be desirable.

After the drying procedure, it is desirable to remove any polar solventor water which may remain in the positive hole injection/transport layer110 a by performing heat processing by heating up the work-piece invacuum to a temperature of approximately 200 degree Celsius and bykeeping it there for about 10 minutes.

In the above described process of forming the positive holeinjection/transport layer, the liquid drops 110 c of the first compositematerial which have been discharged are on the one hand filled into thelower opening portions 112 c and the upper opening portions 112 d, whileany quantities of the first composite material which may have landedupon the organic material bank layers 112 b which have been subjected towater repellentation processing are repelled thereby and are transferredto within the lower opening portions 112 c and the upper openingportions 112 d. Due to this, the liquid drops 110 c of the firstcomposite material which have been discharged can be reliably andinescapably caused to be filled into the lower opening portions 112 cand the upper opening portions 112 d, so that it is possible to form thepositive hole injection/transport layer 110 a upon the electrodesurfaces 111 a.

Furthermore, according to the above described formation process for thepositive hole injection/transport layer, since the liquid drops 110 c 1of the first composite material which are initially discharged into eachof the picture element regions A are contacted against the wall surfaces112 h of the organic material bank layers 112 b, because these liquiddrops are transferred from these wall surfaces 112 h to the firstsuperimposed layer portions 112 e and to the electrode surfaces 111 a,accordingly, as a priority, the liquid drops 110 c of the firstcomposite material wet and spread out over the entire range of thepicture element electrodes 111, and it is possible to apply the firstcomposite material without any blurring, so that thereby it is possibleto form the positive hole injection/transport layer 110 a with asubstantially uniform film thickness.

(4) The Process of Formation of the Light Emission Layer

Next, the process of forming the light emission layer includes a surfacemodification process, a light emission layer formation materialdischarge process, and a drying process.

First, a surface modification process is performed for modifying thesurface of the positive hole injection/transport layer 110 a. Thisprocess will be described in detail hereinafter. Next, a secondcomposite material is discharged upon the positive holeinjection/transport layer 110 a by a liquid drop discharge method whichmay be the same as that employed for the process of formation of thepositive hole injection/transport layer 110 a which was described above.After this, a process of drying processing (and heat processing) of thissecond composite material which has been discharged is performed, andthereby the light emission layer 110 b is formed over the positive holeinjection/transport layer 10 a.

Next, as a process for forming the light emission layer, after a secondcomposite material which contains a light emission layer formationmaterial has been discharged upon the positive hole injection/transportlayer 110 a by a liquid drop discharge method, a drying procedure isperformed, and thereby the light emission layer 110 b is formed over thepositive hole injection/transport layer 110 a.

The liquid drop discharge method is shown in outline in FIG. 46. Asshown in FIG. 46, the ink jet head 431 and the base plate 32 are shiftedrelatively to one another, and the second composite material whichincludes light emission layer formation material of various colors (forexample blue (B) colored light emission layer formation material) isdischarged from the discharge nozzles which are formed in the ink jethead 431.

During this discharge, the discharge nozzles oppose the positive holeinjection/transport layers 110 a which are positioned within the loweropening portions 112 c and the upper opening portions 112 d, and thesecond composite material is discharged while shifting the ink jet head431 and the base plate 32 relatively to one another. The liquid amountsfor each of the drops which are discharged from the discharge nozzlesare controlled for each drop individually. The liquid (the secondcomposite material drops 110 e) of which the liquid amount has beencontrolled in this manner is discharged from the discharge nozzles, andthese second composite material drops 110 e are discharged against andover the positive hole injection/transport layer 10 a.

The process of formation of the light emission layer proceeds in thesame manner as did the process of forming the positive holeinjection/transport layer, so that the second composite material isdischarged from a plurality of the nozzles against a single one of thepicture element regions.

In other words, in the same manner as in the cases shown in FIG. 41,FIG. 42, and FIG. 43, the ink jet head 121 is scanner and the lightemission layer 110 b is formed over each of the positive holeinjection/transport layers 110 a. In this process, For this processthere are three possibilities: (4) a method which is performed with asingle scanning episode of the ink jet head 121; (5) a method which isperformed with a plurality of scanning episodes of the ink jet head 121,and moreover by using a plurality of nozzles during those scanningepisodes; and (6) a method which is performed with a plurality ofscanning episodes of the ink jet head 121, and moreover by using aseparate nozzle in each of those scanning episodes. In the following, asummary of each of these three methods (4) through (6) will beexplained.

(4) A Method Performed with a Single Scan of the Ink Jet Head 121

With this method, a light emission layer is formed upon each of thepicture element regions (over the positive hole injection/transportlayer 110 a) in the same manner as in the case of FIG. 41. In detail, inthe same manner as in the case of FIG. 41(a), the nozzles n1 a throughn3 a of the ink jet head 121 are arranged to oppose the positive holeinjection/transport layers 10 a, and initial liquid drops of the secondcomposite material are discharged from these nozzles n1 a through n3 aagainst the positive hole injection/transport layers 110 a. Next, in thesame manner as in the case of FIG. 41(b), along with scanning the inkjet head 121 a little along the main scanning direction, each of thenozzles nib through n3 b is positioned over the corresponding one ofthese positive hole injection/transport layers 110 a by shifting the inkjet head 121 along the direction opposite to the widthwise scanningdirection, and second liquid drops of the second composite material aredischarged from the nozzles n1 b through n3 b against the positive holeinjection/transport layers 110 a. Then, in the same manner as in thecase of FIG. 41(c), while scanning the ink jet head 121 a little alongthe main scanning direction, each of the nozzles n1 a through n3 a isagain positioned over its positive hole injection/transport layer 110 aby shifting the ink jet head 121 along the widthwise scanning direction,and third liquid drops of the second composite material are dischargedfrom the nozzles n1 a through n3 a against the positive holeinjection/transport layers 110 a.

By doing this, i.e. by shifting the ink jet head 121 a little to and froalong the widthwise scanning direction while scanning the ink jet head121 along the main scanning direction, liquid drops of the secondcomposite material are discharged against a single picture elementregion A (a single positive hole injection/transport layer 110 a) inorder from two of the nozzles. The total number of liquid drops whichare discharged against a single picture element region A can be in therange, for example, from 6 to 20, but this range will vary according tothe area of the picture elements, and in some circumstances the mostappropriate number of drops may be greater or less than this statedrange. The total amount of the second composite material which isdischarged against each of the picture element regions (each of thepositive hole injection/transport layers 110 a) is determined accordingto the sizes of the lower opening portions 112 c and the upper openingportions 112 d, according to the thickness of the light emission layerswhich it is desired to form, according to the concentration of thematerial for forming the light emission layers within the secondcomposite material, and the like.

In this manner, for the case of forming the light emission layer in asingle scanning episode, the nozzles are changed over every time thesecond composite material is discharged, and, since the second compositematerial is discharged against each of the picture element regions fromtwo of the nozzles, accordingly, by comparison with the case ofdischarging the second composite material against each of the pictureelement regions a plurality of times from a single nozzle as in theprior art, it is possible to perform mutual cancellation betweenundesirable deviations in the discharge amounts between the nozzles, sothat undesirable deviations in the discharge amounts of the secondcomposite material upon each of the picture element regions are reduced,and it is possible to form the light emission layer of a uniform filmthickness. By doing this, it is possible to ensure that the amount ofemitted light from each of the picture elements should be maintained tobe uniform, and accordingly it is possible to manufacture a displaydevice which is endowed with a superior display quality.

(5) A Method Performed with a Plurality of Scans of the Ink Jet Head121, and a Method Using a Plurality of Nozzles During Those Scans

In this method, first in the same manner as in the case of FIG. 42(a),in a first scanning episode, among the various nozzles of the ink jethead 121, the initial liquid drops of the second composite material aredischarged from the nozzles n1 a through n3 a against the pictureelement regions which these nozzles respectively oppose, and then theink jet head 121 is shifted a little in the widthwise scanning directionand the second liquid drops of the second composite material aredischarged from the nozzles nib through n3 b against the picture elementregions which these nozzles respectively oppose.

By doing this, in the same manner as shown in FIG. 42(a), two liquiddrops are discharged against each of the picture element regions. Itshould be understood that each of these first and second liquid dropsmay be discharged against its one of the picture element regions with aninterval being mutually opened up between them, in the same manner asshown in FIG. 42(a); or, alternatively, they may be discharged over oneanother in a mutually superimposed manner.

Next, in the second scanning episode, in the same manner as during thefirst scanning episode, among the various nozzles of the ink jet head121, the third liquid drops of the second composite material aredischarged from the nozzles n1 a through n3 a against the pictureelement regions which these nozzles respectively oppose, and then againthe ink jet head 121 is shifted a little in the widthwise scanningdirection and the fourth liquid drops of the second composite materialare discharged from the nozzles n1 b through n3 b against the pictureelement regions which these nozzles respectively oppose. By doing this,in the same manner as shown in FIG. 42(b), the further two liquid dropsare discharged against each of the picture element regions. It should beunderstood that each of these third and fourth liquid drops may bedischarged against its one of the picture element regions with aninterval being opened up mutually between them and also with an intervalbeing opened up between them and the first and second liquid drops andso that none of these four liquid drops are mutually superimposed, inthe same manner as shown in FIG. 42(b); or, alternatively, they may bedischarged over one another and over the first and second liquid drops,so that all four are mutually superimposed.

Next, in the third scanning episode, in the same manner as during thefirst and second scanning episodes, among the various nozzles of the inkjet head 121, the fifth liquid drops of the second composite materialare discharged from the nozzles n1 a through n3 a against the pictureelement regions which these nozzles respectively oppose, and then againthe ink jet head 121 is shifted a little in the widthwise scanningdirection and the sixth liquid drops of the second composite materialare discharged from the nozzles n1 b through n3 b against the pictureelement regions which these nozzles respectively oppose. By doing this,in the same manner as shown in FIG. 42(c), a further two liquid dropsare discharged against each of the picture element regions. It should beunderstood that each of these fifth and sixth liquid drops may bedischarged against its one of the picture element regions with aninterval being opened up mutually between them and also with an intervalbeing opened up between them and the first four liquid drops so thatnone of these six liquid drops are mutually superimposed, in the samemanner as shown in FIG. 42(c); or, alternatively, they may be dischargedover one another and over the first through the fourth liquid drops, sothat all six of the liquid drops are mutually superimposed.

Since in this manner, when forming the light emission layer with aplurality of scans, the nozzles are changed over between each scan andthe next, and the second composite material is discharged against eachof the picture element regions from its own two ones of the nozzles,accordingly, by comparison with the case of discharging the secondcomposite material against each of the picture element regions aplurality of times from a single nozzle as in the prior art, it ispossible to perform mutual cancellation between undesirable deviationsin the discharge amounts between the nozzles, so that undesirabledeviations in the discharge amounts of the second composite materialupon each of the picture element regions are reduced, and it is possibleto form the light emission layer of a uniform film thickness. By doingthis, it is possible to ensure that the amount of emitted light fromeach of the picture elements is maintained as uniform, and accordinglyit is possible to manufacture a display device which is endowed with asuperior display quality.

(6) A Method Performed with a Plurality of Scans of the Ink Jet Head121, and by Using a Different Nozzle in Each of Those Scans

In this method, first, in the same manner as shown in FIG. 43(a), in afirst scanning episode, the initial liquid drops and the second andthird liquid drops of the second composite material are discharged inorder from each of the nozzles n1 a through n3 a among the variousnozzles of the ink jet head 121 against each of the picture elementregions which these nozzles respectively oppose. By doing this, in thesame manner as shown in FIG. 43(a), three liquid drops are dischargedagainst each of the picture element regions. It should be understoodthat each of these liquid drops may be discharged against its one of thepicture element regions with an interval being mutually opened upbetween them, in the same manner as shown in FIG. 43(a); or,alternatively, they may be discharged over one another so as to bemutually superimposed.

Then, in the second scanning episode, the ink jet head 121 is shifted alittle in the widthwise scanning direction and the fourth, fifth, andsixth liquid drops of the second composite material are discharged inorder from the nozzles n1 b through n3 b against the picture elementregions which these nozzles respectively oppose. By doing this, in thesame manner as shown in FIG. 43(b), the further three liquid drops aredischarged against each of the picture element regions. It should beunderstood that each of these fourth through sixth liquid drops may bedischarged against its one of the picture element regions with aninterval being opened up mutually between them and also with an intervalbeing opened up between them and the first three liquid drops so thatnone of these six liquid drops are mutually superimposed, in the samemanner as shown in FIG. 43(b); or, alternatively, they may be dischargedover one another and over the first through the third liquid drops, sothat all six of these liquid drops are mutually superimposed.

Furthermore, as a variant of this method, in the same manner as shown inFIG. 43(c), the liquid drops which are discharged in the first scanningepisode may all be located in one half portion of each of the pictureelement regions, while the liquid drops which are discharged in thesecond scanning episode are all located in the other half portion ofeach of the picture element regions; in other words, the liquid dropswhich are discharged in the first scanning episode are not interleavedwith the liquid drops which are discharged in the second scanningepisode.

It should be understood that although the total number of liquid dropswhich are discharged against a single picture element region wassupposed to be six, it may be in the range, for example, from 6 to 20;but, since this range will vary according to the area of the pictureelements, in some circumstances the most appropriate number of drops maybe greater or less than this stated range. The total amount of thesecond composite material which is discharged against each of thepicture element regions (i.e., upon each of the positive holeinjection/transport layers 110 a) is determined according to the sizesof the lower opening portions 112 c and the upper opening portions 112d, according to the thickness of the light emission layer which it isdesired to form, according to the concentration of the material forforming the light emission layer within the second composite material,and the like.

Since in this manner, when forming the positive hole injection/transportlayer with a plurality of scanning episodes, the nozzles are changedover between each scan and the next, and the second composite materialis discharged against each of the picture element regions from its owntwo ones of the nozzles, accordingly, by comparison with the case ofdischarging the second composite material against each of the pictureelement regions a plurality of times from a single nozzle as in theprior art, it is possible to perform mutual cancellation betweenundesirable deviations in the discharge amounts between the nozzles, sothat undesirable deviations in the discharge amounts of the secondcomposite material upon each of the picture element regions are reduced,and it is possible to form the light emission layer of a uniform filmthickness. By doing this, it is possible to ensure that the amount ofemitted light from each of the picture elements is maintained asuniform, and accordingly it is possible to manufacture a display devicewhich is endowed with a superior display quality.

It should be understood that, in the same way as was the case in theprocess of forming the positive hole injection/transport layer, it wouldalso be acceptable, when performing scanning of the ink jet head 121 aplurality of times, to perform each pass of the ink jet head 121, i.e.each scan, in the same direction; or, alternatively, each pass of theink jet head 121 might be performed in an opposite direction to theprevious one.

Furthermore, as the material for the light emission layer, for example,it is possible to utilize polyfluolenederivetive,polyphenylenederivative, polyvinylcarbazole, polythiophenederivative, ordoped materials by doping penylene group pigments, coumaline grouppigments, rhodamine group pigments, for instance, rublene, perylene,9,10-diphenylanthracene, terraphenylbutadiene, neilred, coumalin 6,quinacridone or the like with the above polymers may be used.

As a non polar solvent, which is a desirable type from the point of viewof not dissolving the previously formed positive holeinjection/transport layers 110 a, it is possible to use, for example,cychrohexilbenzene, dihydrobenzofuran, trimethylbenzene,tetramethylbenzene, or the like.

By using this type of non polar solvent in the second composite materialfor making the light emission layers 110 b, it is possible to apply thesecond composite material without re-dissolving the positive holeinjection/transport layers 110 a which have already been formed.

As shown in FIG. 46, the liquid drops 110 e of the second compositematerial which have been discharged from the ink jet head 121 spread outover the 1 positive hole injection/transport layer 1104 a, and fill upthe lower opening portions 112 c and the upper opening portions 112 d.On the other hand, even if one of the liquid drops 110 e of the secondcomposite material has wandered from its predetermined dischargeposition and has been discharged against an upper surface 112 f whichhas been subjected to water repellentation processing, the upper surface112 f is not wetted by this second composite material drop 110 e, andthe second composite material drop 110 e is shed off from the uppersurface 112 f and is transferred to one of the lower opening portions112 c or one of the upper opening portions 112 d.

Next, after the second composite material has been discharged in thepredetermined positions therefor, a drying procedure is performed forthe drops 110 e of the second composite material after their discharge,so as to form the light emission layer 110 b 3. That is to say, the nonpolar solvent which was contained in the second composite material isvaporized by this drying process, and a blue (B) colored light emissionlayer 110 b 3 such as shown in FIG. 47 is formed. It should beunderstood that, although in FIG. 47 only a single light emission layer110 b 3 which emits blue colored light is shown, in fact, as is clearfrom FIG. 30 and other figures, basically the light emitting elementsare formed so as to be arranged in a matrix pattern, and, viewing thecomponent as a whole, a large number of light emission layers(corresponding to blue color) not shown in the figure are formed.

Next, as shown in FIG. 48, a red (R) colored light emission layer 110 b1 is formed by using the same process as in the case of formation of theblue (B) colored light emission layer 110 b 3 as described above; and,finally, a green (G) colored light emission layer 110 b 2 is formed byusing the same technique.

It should be understood that the order in which these three lightemission layers 110 b are formed is not to be considered as beinglimited by the example above; any suitable order would be acceptable.For example, it would also be possible to determine the order offormation of the light emission layers, according to the specificqualities of the materials from which they were to be formed.

As drying conditions for the second composite material for forming thelight emission layer, for example, in the case of the blue (B) coloredlight emission layer 110 b 3, they may be: in a nitrogen atmosphere, atroom temperature, and at a pressure of, for example, approximately 133.3to 13.3 Pa (1 to 0.1 torr). If the pressure were too low, the secondcomposite material drops 110 c would be caused to collide with oneanother, which would be undesirable. Furthermore, it the temperaturewere too high, the speed of vaporization of the non polar solvent wouldbe elevated to a level which would be undesirable, and it might be thecase that a large quantity of the light emission layer formationmaterial might adhere to the wall surfaces of the upper opening portions112 d. Accordingly a working temperature in the range of from 30 degreeCelsius to 80 degree Celsius is considered to be desirable.

Furthermore, in the cases of the green (G) colored light emission layer110 b 2 and of the red (R) colored light emission layer 110 b 1, it isdesirable to perform the drying gently, since the number of thecomponents in the material from which the light emission layer is to beformed is relatively large. For example, as acceptable conditions, itmay be acceptable to perform this drying by blowing nitrogen against thework-piece at a temperature of 40 degree Celsius for about 5 to 10minutes.

As another possible means of performing this drying procedure, aninfrared irradiation method, or a method of blowing nitrogen gas at hightemperature against the work-piece, or the like may be utilized.

By the above procedures, the positive hole injection/transport layers110 a and the light emission layers 110 b are formed above the pictureelement electrodes 111.

(5) The Process of Formation of the Opposing Electrode (the NegativeElectrode)

Next, in an opposing electrode formation process, the negative electrode42 (the opposing electrode) is formed over the entire surfaces of thelight emission layers 110 b and the organic material bank layers 112 b,as shown in FIG. 49. It should be understood that it would also beacceptable, as an alternative, to form this negative electrode 42 from aplurality of layers of different materials superimposed upon oneanother. For example, it is desirable to form the side of the negativeelectrode 42 towards the light emission layer from a material whose workfunction is small, and for example it is possible to use Ca or Ba or thelike for this portion, or, for this material, there are also cases inwhich it is best to make this lower layer as a thin layer of LiF or thelike. Furthermore, for the upper side (the sealing side) of the negativeelectrode 42, it is possible to utilize a material whose work functionis higher than that of the material used for the lower side thereof, forexample Al or the like.

Yet further, it is desirable to form the negative electrode 42 by, forexample, an evaporation adhesion method, a spattering method, a CVDmethod or the like, and in particular, it is desirable to form it by anevaporation adhesion method, from the point of view of being able toprevent damage to the light emission layers 110 b due to heat.

Furthermore, it would also be acceptable to form only the portions overthe light emission layers 110 b from lithium fluoride; or it would alsobe possible to form the lithium fluoride portion in correspondence to apredetermined color or colors. For example, it would be acceptable toform the lithium fluoride portion over only the blue (B) colored lightemission layers 110 b 3. In this case, an upper negative electrode layer12 b which was made from calcium or the like would be contacted againstthe red (R) colored light emission layers 110 b 1 and against the green(G) colored light emission layers 110 b 2.

Furthermore, it is desirable for an Al layer, an Ag layer or the like tobe formed over the upper portion of the negative electrode 42 by anevaporation deposition method, a spattering method, a CVD method or thelike. Yet further, it is desirable for the thickness of this layer tobe, for example, in the range from 100 to 1000 nm, and in particular itmay be in the range from approximately 200 to 500 nm.

Moreover, it would be acceptable to provide a protective layer of SiO2,SiN or the like over the negative electrode 842, for preventation ofoxidization thereof.

(6) The Process of Sealing

The final sealing process is a process of sealing between the base plate32 upon which the light emitting element is formed and the sealingsubstrate plate 3 b using a sealing resin 3 a. For example, a sealingresin 3 a which consists of a heat curing resin or an ultraviolet lightcuring resin is applied over the entire surface of the base plate 32,and a substrate plate 3 b for sealing is laid over this sealing resin 3a, i.e. is superimposed thereupon. By this process, a sealing portion 33is formed over the base plate 32.

It is desirable for this sealing process to be performed in an inert gasatmosphere of nitrogen, argon, helium or the like. If this sealingprocess is performed in the ambient atmosphere, then, if defect portionssuch as pinholes or the like have occurred in the negative electrode 42,there is a danger that water or oxygen or the like may enter into thenegative electrode 42 through these defect portions, and may oxidize thenegative electrode 42, which is not desirable.

Furthermore, along with connecting the negative electrode 42 to a leadwire 35 a of the substrate plate 5 as shown by way of example in FIG.30, the lead wires of the circuit element portion 44 are connected tothe drive IC 36, and thereby the display device 31 of this preferredembodiment of the present invention is obtained.

In this preferred embodiment as well, by performing the ink jet methoddescribed above in the same manner as in the case of the other preferredembodiments explained previously, the same beneficial results areobtained in the same manner. Furthermore since, when selectivelyapplying the functional liquid masses, the liquid mass for a singlefunctional layer is discharged by using a plurality of nozzles,accordingly it is possible to eradicate deviations in the dischargeamounts between the nozzles, so that, by reducing variations in theamounts of source material between each of the electrodes, it ispossible to ensure that each of the functional layers has a uniform filmthickness. By doing this, it is possible to ensure that the amount ofemitted light from each of the picture elements is maintained asuniform, and accordingly it is possible to manufacture a display devicewhich is endowed with a superior display quality.

OTHER PREFERRED EMBODIMENTS

Although the present invention has been described above in terms ofcertain preferred embodiments thereof, the present invention is not tobe considered as being limited by these preferred embodiments; andvariations such as will now be described above are acceptable, providedthat the objectives of the present invention are attained. In otherwords, it is possible to implement multitudinous variations in theconcrete structure and form of the present invention, without departingfrom the scope of the present invention, which is to be defined solelyby the scope of the appended claims.

In other words although, by way of example, the main scanning of themotherboard 12 by the ink jet head 421 was performed by shifting the inkjet head 421 along the main scanning direction X, and the widthwisescanning of the motherboard 12 by the ink jet head 421 was performed byshifting the motherboard 12 with the widthwise scanning drive device425, it would be possible to implement an opposite arrangement, in whichthe main scanning was executed by shifting the motherboard 12, and thewidthwise scanning was executed by shifting the ink jet head 421.Furthermore, it would also be possible to implement various other sortsof structure in which the ink jet head 421 and the surface of themotherboard 12 were mutually shifted respectively to one another, byshifting only the motherboard 12 without shifting the ink jet head 421,or by shifting only the ink jet head 421 without shifting themotherboard 12, or by shifting both of them in relatively oppositedirections, or the like.

Furthermore, although in the above described preferred embodiments anink jet head 421 was utilized which was made so as to discharge the inkby taking advantage of the flexible deformation of the piezoelectricelements, it would also be possible to utilize an ink jet head of anyother different structure; for example, one which utilized a method ofdischarging the ink in pulses which were generated by heating up theink.

Yet further although, in the preferred embodiments shown in FIGS. 1through 13, for the irk jet head 421, one was explained in which thenozzles 466 were arranged at substantially equal intervals and in tworows along substantially straight lines, the present invention is not tobe considered as being limited to the case of two rows; it would bepossible for various different numbers of rows to be utilized. Moreover,the intervals between the nozzles 466 along their rows need not all beequal to one another. Yet further, it is not even necessary for thenozzles 466 to be arranged along straight lines.

And the objects for the manufacture of which the liquid drop dischargedevices 16, 401 may be used are not to be considered as being limited tothe liquid crystal device 101 and the electro-luminescent device 201;these liquid drop discharge devices 16, 401 may also be applied to theproduction of a wide range of electro optical devices which comprisesubstrate plates and predetermined layers formed in predetermined placesthereupon, such as an electron emission device such as a FED (FieldEmission Display) or the like, a PDP (Plasma Display Panel), anelectrical migration device—in other words a device in which ink, whichis a functional liquid mass which includes charged grains, is dischargedinto concave portions between division walls which separate variouspicture elements, and which performs display by applying voltage betweenelectrodes which are disposed above and below each picture element so asto sandwich it, whereby the charged grains are attracted towards one ofthe electrodes—a CRT (Cathode Ray Tube) display such as a thin type CRT,or the like.

The device and the method of the present invention can be utilized invarious processes for manufacturing various types of devices which havesubstrate plates (backings), including electro optical devices, in whichit is possible to employ a process of discharging liquid drops againstsuch a backing. For example, they can be applied to manufacture of anyof the following structures: a structure consisting of electricalconnecting wires upon a printed circuit substrate plate, in which theseelectrical connecting wires are formed by discharging a liquid metal oran electro-conductive material, or a paint containing a metallicsubstance or the like, against this printed circuit substrate plate byusing an ink jet method; a structure for a fuel cell in which anelectrode or an ion conduction layer or the like is formed by dischargeusing an ink jet method; a structure in which an optical member such asa minute micro lens is formed upon a backing by discharge using an inkjet method; a structure in which a resist, which is to be applied on asubstrate plate, is applied only upon appropriate portions thereof bydischarge using an ink jet method; a structure in which convex portionsfor scattering light, or a minute white pattern or the like, are formedupon a transparent substrate plate made from a plastic or the like bydischarge using an ink drop method, so as to form a light scatteringplate; or a structure in which a biochip is formed by discharging RNA(ribonucleic acid) using an ink drop method upon spike spots which arearranged in a matrix array upon a DNA (deoxyribonucleic acid) chip suchas a reagent inspection device or the like, or in which a sample or anantibody, or DNA (deoxyribonucleic acid) or the like, is dischargedusing an ink jet method upon a backing in positions in dot form whichare compartmented apart, so as to manufacture a fluorescent marker probeby performing hybridization or the like upon a DNA chip; or the like.

Furthermore, as well as to a complete liquid crystal device 101, thepresent invention can also be applied to any portion which is includedin an electro optical system of a liquid crystal device, such as astructure such as an active matrix liquid crystal panel which comprisesTFT transistors or the like or active elements such as TFDs in thepicture elements, or the like, in which division walls 6 are formedwhich define and surround the picture element electrodes, and in whichink is discharged by an ink jet method in the concave portions which aredefined by these division walls 6, so as to form a color filter 1; or astructure in which a color filter 1 is formed as an electro-conductivecolor filter upon picture element electrodes by discharging a mixture ofa colored material and an electro-conductive material, which serves asan ink, against the picture element electrodes using an ink jet method;or a structure which is formed by discharging, using an ink jet method,particles of a spacer for maintaining a gap with respect to a substrateplate; or the like.

Yet further, the present invention is not limited in its application toa color filter 1 or to an electro-luminescent device; it can also beapplied to any other type of electro optical device. Moreover, in thecase of the electro-luminescent device as well, the present inventioncan also be applied to any of various structures, such as one in whichthe electro-luminescent layers which correspond to the three colors R,G, and B are formed in a stripe pattern, or, as described above, it canbe applied to an display device of the active matrix type whichcomprises transistors which control the flow of electric current in thelight emission layers for each of the picture elements individually, orto one of the passive matrix type, or the like.

And, as for the electronic device to which the electro optical deviceaccording to any of the above described preferred embodiments of thepresent invention is assembled, its application is not to be consideredas being limited to a personal computer 490 such as shown, for example,in FIG. 27; on the contrary, it is possible to adapt the presentinvention to various types of electronic device, such as a portabletelephone instrument like the portable telephone 491 shown in FIG. 28 ora PHS (Personal Handyphone System) unit or the like, or to an electronicnotebook, a POS (Point Of Sale) terminal, an IC card, a mini discplayer, a liquid crystal projector, an engineering workstation(Engineering Work Station: EWS), a word processor, a television, a videotape recorder of the viewfinder type or the direct vision monitor type,a tabletop electronic calculator, a car navigation device, a deviceincorporating a touch panel, a watch, a game device, or the like.

Further to the embodiments in which the division walls 6 of the colorfilter 1 are formed from the resin materials which are non transparent,resin materials which are transparent are available for the divisionwalls. In this case, shading members made of metal layer or resinmaterial which locate between the filter elements 3, for instance overthe division walls 6 and beneath the division walls 6, and perform as ablack musk are available. It should be understood that in thisdescription of the present invention the term “division wall” is used toinclude the meaning of “bank”, and is an expression of which denotesportions which are convex as seen from the substrate plate, are almostperpendicular or which have angles somewhat greater than or what lessthan roughly 90 degree.

The colors of the filter element 3 are not limited in R, G, and B of theembodiments, colors of C (cyan), M (magenta), and Y (yellow) are alsoutilized. In a case of utilizing C, M and Y, filter element materials 13having colors of C, M and Y are utilized in place of the filter elementmaterials 13 having colors of R, G and B.

It should be understood that the structure and the procedures of thevarious preferred embodiments of the present invention which have beendisclosed in concrete terms are not intended to be limiting; otherversions thereof which fall within the scope of the appended claims, andwhich attain the objectives of the present invention, will beacceptable, and are not to be considered as departing from its range.

1. An electro-optical device, comprising: a substrate having electrodes;and electro-luminescent layers provided in correspondence with theelectrodes upon the substrate, wherein: each of a plurality of dischargeapparatuses comprises a nozzle surface having at least one nozzle thatdischarges a liquid containing an electro-luminescent material; aholding apparatus holds and arranges the discharge apparatuses so thatthe nozzles are linearly-arranged along a first direction; and thedischarge apparatuses discharge the liquid from predetermined nozzles topredetermined positions on the substrate so as to form theelectro-luminescent layers, while relatively moving the dischargeapparatuses and the substrate along the first direction, and while thenozzle surface of each of the discharge apparatuses is directed alongthe surface of the substrate.